Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Maximum Insertion Loss: 2 dB; No. of Functions: 1; Maximum Operating Frequency: 13000 MHz;
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Futuretech Components
RF/Microwave Switches HMC1118LP3DE attributes and parameters. Explore more RF/Microwave Switches devices from Hittite Microwave
Compression Point (1 dB):
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
Minimum Isolation:
JESD-609 Code:
Mounting Feature:
No. of Functions:
No. of Terminals:
Nominal On Time:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Port Termination:
Power Supplies (V):
RF or Microwave Device Type:
Maximum Supply Current:
Terminal Finish:
HMC1118LP3DE RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.50.70.00
SB
NORWOOD, Mass. & CHELMSFORD, Mass.--(BUSINESS WIRE)-- Analog Devices, Inc. (NASDAQ:ADI), a global leader in high-performance semiconductors for signal processing applications, and Hittite Microwave Corporation (NASDAQ:HITT), an innovative designer and manufacturer of high performance integrated circuits, modules, subsystems and instrumentation for RF, microwave and millimeter wave applications, today announced that the two companies have entered into a definitive agreement whereby ADI will acquire Hittite for $78 per share in cash. The closing price of Hittite's common stock on June 6, 2014 was $60.56 per share. This agreement reflects a total enterprise value for Hittite of approximately $2 billion. ADI expects to fund the acquisition through a combination of cash on hand and short-term debt financing. The Boards of Directors of each company have approved the transaction, which is expected to close near the end of ADI's third fiscal quarter of 2014, subject to regulatory approvals and other customary closing conditions.
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Crystalonics
General Diode
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
UPG2176T5N-E2
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 17 dB;
HMC546MS8GTR
Analog Devices
Analog Devices' HMC546MS8GTR is a GAAS technology RF switch with 1.5 dB max insertion loss and 8 dB min isolation. Operating at up to 2200 MHz, it's ideal for diversity switching applications in temperatures ranging from -40 °C to 85°C. With a compact surface mount package, it offers fast 0.102 us nominal on time for seamless performance.
UPG2030TK-E2
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
AS222-92LF
Skyworks Solutions
AS222-92LF by Skyworks Solutions is a SPDT RF/Microwave switch with max input power of 33.01 dBm and VSWR of 1.4. It operates from -40 to 85°C, has insertion loss of 0.7 dB, and isolation of 16 dB. Ideal for applications requiring high-frequency switching in communication systems.
ADRF5026
Analog Devices' ADRF5026 is a 50 ohm RF/Microwave Diversity Switch with max freq of 44 GHz and CW power handling of 25.05 dBm. Ideal for applications requiring high-frequency switching in environments ranging from -55 °C to 105°C.
F2914NBGK8
SP4T; Terminal Finish: TIN; JESD-609 Code: e3;
UPG168TB-E4
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: TSSOP6,.08;
HMC544A
Analog Devices' HMC544A is a RF/Microwave Switch with max input power of 39 dBm, insertion loss of 1 dB, and operating frequency range from 0-4000 MHz. Ideal for diversity switch applications due to its 50 ohm impedance and wide temperature range (-40 to +85°C).
HMC270AMS8GETR
Analog Devices' HMC270AMS8GETR is a SPDT RF switch with 2.8 dB max insertion loss, 1.5 VSWR, and 28 dB min isolation. Ideal for RF/Microwave applications, it operates from -40 to 85°C and handles up to 25.5 dBm CW power, making it suitable for various communication systems.
TG2203F
Toshiba
SPDT;
UPG107B
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: GAAS; Power Supplies (V): -5;
CSH510
Infineon Technologies
SP5T; Maximum Insertion Loss: 1.1 dB; Maximum Operating Frequency: 2000 MHz; Minimum Operating Frequency: 1000 MHz; Construction: COMPONENT; Maximum Input Power (CW): 37.78 dBm;
HMC348LP3
HMC348LP3 by Analog Devices is a RF/Microwave Switch with 30 dBm CW input power, 28 dBm compression point, and 1 dB max insertion loss. It operates from -40 to 85 °C and has 16 terminals for SPDT applications in the frequency range of 0-2500 MHz.
UPG2214TK-E2
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: FL6,.047,20;
HMC284MS8GE
Hittite Microwave
Hittite Microwave's HMC284MS8GE is a SPDT RF switch with 1.1 dB max insertion loss, 30 dB min isolation, and 3500 MHz max operating frequency. Ideal for RF/Microwave applications requiring high power handling up to 26.02 dBm CW input.
TG2211FT
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; JESD-609 Code: e0;
SPM3313
The Onsemi SPM3313 is an RF/Microwave Switch with a max freq of 2500 MHz. It features a VSWR of 1.5, Compression Point at 30 dBm, and Insertion Loss of 0.55 dB. Ideal for SPDT applications in temperature range -40 to 85 °C, with 6 terminals and surface mounting feature.
RFX2411N
DIVERSITY SWITCH;
PE42540LGBD-Z
Psemi
PE42540LGBD-Z by Psemi is a SP4T RF switch with 1.6 dB max insertion loss, 30 dBm CW power handling, and VSWR of 1.1. Ideal for applications requiring high-frequency switching in RF/microwave systems with operating frequency range from 0.00001 MHz to 8000 MHz.
ADG919BRM-REEL
ADG919BRM-REEL by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals. It operates from -40 to 85 °C, with max freq of 4 GHz and min isolation of 34 dB. Ideal for applications requiring high power handling up to 17.99 dBm CW.
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HMC1118LP3DETR
Analog Devices' HMC1118LP3DETR is a RF/Microwave SPDT switch with 50 ohm impedance, offering 18 dB isolation and 2 dB insertion loss. It operates from 0.009 MHz to 13000 MHz, handles up to +28 dBm CW power, and has a compression point of +37 dBm. Ideal for applications requiring high-frequency signal routing in communication systems.
HMC1118LP3DE
HMC1118LP3DE by Analog Devices is an RF/Microwave Switch with a max input power of 28 dBm and compression point of 37 dBm. It operates b/w -40 to 85 °C, has a max insertion loss of 2 dB, and offers SPDT functionality. Ideal for applications requiring high-frequency switching in compact designs.
HMC1084LC4TR
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Power Supplies (V): -3;
HMC174MS8RTR
TRANSFER SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Compression Point (1 dB): 36 dBm;
HMC174MS8TR
TRANSFER SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Frequency: 3000 MHz;
HMC182S14
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Characteristic Impedance: 50 ohm;
HMC104
SPDT; Technology: GAAS; Power Supplies (V): -5; Maximum Operating Temperature: 125 Cel; Port Termination: ABSORPTIVE; No. of Functions: 1;
HMC1055LP2CETR
DIVERSITY SWITCH; Maximum Operating Frequency: 4000 MHz; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Additional Features: HIGH ISOLATION;
HMC182S14E
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;
HMC174MS8ETR
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Port Termination: REFLECTIVE;
HMC106
SPDT; Technology: GAAS; Maximum Operating Temperature: 125 Cel; No. of Functions: 1; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP;
HMC174MS8
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: TSSOP8,.19;
HMC1055LP2CE
DIVERSITY SWITCH; Maximum Input Power (CW): 34 dBm; Terminal Finish: MATTE TIN; Minimum Operating Frequency: 0 MHz; JESD-609 Code: e3; Additional Features: CMOS COMPATIBLE;
HMC174MS8E
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 15 dB;
HMC103
SPST; Technology: GAAS; Maximum Insertion Loss: 2 dB; Package Equivalence Code: DIE OR CHIP; Compression Point (1 dB): 27 dBm; Power Supplies (V): -5/-8;
HMC105
SPST; Technology: GAAS; No. of Functions: 1; Package Equivalence Code: DIE OR CHIP; Nominal On Time: .006 us; Power Supplies (V): -5/-8;
HMC1084LC4
SP4T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Maximum Input Power (CW): 30 dBm;
HMC174MS8ERTR
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: 1.8 dB;
Supply Digital Components
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