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TCM29C17N-10

Texas Instruments

TCM29C17N-10 by Texas Instruments

Texas Instruments TCM29C17N-10 is a PCM CODEC with A-LAW companding law. Operating in synchronous mode, it has 16 terminals in an IN-LINE package style. With -5V negative supply voltage and 5V nominal voltage, it's ideal for telecom applications due to its filter feature and commercial temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,844 parts In-Stock

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Digiode

USA . 1,265 parts In-Stock

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1,265

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Distributors (Availability)

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Parana Technologies

USA . 1,042 parts In-Stock

1+ parts

$11.915

100+ parts

-

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$12.316

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1,042

$11.915

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$12.316

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DigiPath Technology Company

USA . 341 parts In-Stock

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$13.120

100+ parts

$12.071

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341

$13.120

$12.071

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ChromeModa Solutions

Germany . 6,179 parts In-Stock

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$13.388

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$10.978

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$13.388

$10.978

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IDEA Electronic Components Group

UK . 184 parts In-Stock

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$13.388

100+ parts

$12.719

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$12.049

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184

$13.388

$12.719

$12.049

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AZTECH Wire

Italy . 776 parts In-Stock

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$15.999

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776

$15.999

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Semicontronic

India . 648 parts In-Stock

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$274.000

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$267.150

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$265.780

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648

$274.000

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$265.780

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Ampacity Inc.

Singapore . 339 parts In-Stock

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$755.000

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339

$755.000

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One Stop Electronics

USA . 1,480 parts In-Stock

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$861.000

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1,480

$861.000

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Corphita

USA . 2,034 parts In-Stock

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2,034

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Corohmni

South Africa . 451 parts In-Stock

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Overview

Upgrade your audio experience with the TCM29C17N-10 from Texas Instruments. This top-of-the-line Audio Codec offers unparalleled quality and reliability backed by the trusted name of Texas Instruments. Perfect for a variety of applications, this PCM CODEC delivers crystal-clear sound and seamless performance. Say goodbye to subpar audio quality and hello to a new level of excellence with the TCM29C17N-10.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the audio codec, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronization with other components in the system, resulting in accurate audio data transmission.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and integration with other devices in the audio system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this audio codec can withstand heat and maintain performance in various environmental conditions.

Companding Law: A-LAW

A-Law companding law ensures efficient compression and expansion of audio signals, maintaining high fidelity and dynamic range in the audio codec.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V allows for stable power supply to the audio codec, ensuring consistent performance.

Filter: YES

Having a built-in filter in the audio codec helps in reducing noise and improving the overall audio quality, making it a reliable choice for audio processing applications.

Technical Specifications

Audio Codecs TCM29C17N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C17N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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