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TCM2914FN

Texas Instruments

TCM2914FN by Texas Instruments

Texas Instruments TCM2914FN is a PCM CODEC with +-5V power supplies, 28 terminals, and 43mA max supply current. Ideal for telecom applications, it operates b/w 0-70°C with A/MU-LAW companding law and MOS technology for audio codecs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,036 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,036

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Vyrian

USA . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 396 parts In-Stock

1+ parts

$10.120

100+ parts

-

1k+ parts

$10.666

10k+ parts

-

396

$10.120

-

$10.666

-

DigiPath Technology Company

USA . 1,787 parts In-Stock

1+ parts

$11.144

100+ parts

-

1k+ parts

-

10k+ parts

-

1,787

$11.144

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-

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ChromeModa Solutions

Germany . 5,619 parts In-Stock

1+ parts

$11.371

100+ parts

$9.324

1k+ parts

-

10k+ parts

-

5,619

$11.371

$9.324

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

1+ parts

$11.371

100+ parts

$10.802

1k+ parts

$10.234

10k+ parts

-

1,124

$11.371

$10.802

$10.234

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$19.422

100+ parts

-

1k+ parts

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10k+ parts

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460

$19.422

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One Stop Electronics

USA . 1,352 parts In-Stock

1+ parts

$888.000

100+ parts

-

1k+ parts

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10k+ parts

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1,352

$888.000

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Corphita

USA . 4,749 parts In-Stock

1+ parts

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100+ parts

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4,749

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Overview

Enhance your audio projects with the TCM2914FN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This audio codec offers unparalleled value with its high-performance capabilities. Whether you're working on telecommunications, audio processing, or other applications, this product is designed to meet your needs. Experience the benefits of seamless integration, superior sound quality, and efficient power management. Upgrade your projects today with the TCM2914FN from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate the product into circuit boards, saving space and improving overall design efficiency.

Power Supplies (V): +-5

The dual power supply of +-5 V allows for flexibility in powering the device, ensuring compatibility with various systems and setups.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options and interfaces for seamless integration with other components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable and stable performance even in demanding operating environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function effectively in a wide range of temperature conditions.

Companding Law: A/MU-LAW

The A/MU-LAW companding law ensures high-quality audio encoding and decoding, making it suitable for telecom and audio applications.

Maximum Gain Tolerance: 0.18 dB

The precise maximum gain tolerance of 0.18 dB ensures accurate and consistent audio output levels, improving overall sound quality.

Filter: YES

The inclusion of a filter helps in eliminating unwanted noise and enhancing the clarity of audio signals, making it an ideal choice for audio processing applications.

Technical Specifications

Audio Codecs TCM2914FN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.18 dB

JESD-30 Code:

R-PQCC-J28

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.4X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

43 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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