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TCM2913J-00

Texas Instruments

TCM2913J-00 by Texas Instruments

Texas Instruments TCM2913J-00 is a PCM CODEC with A/MU-LAW companding law. Operating in synchronous mode, it has 20 terminals in an IN-LINE package style. Ideal for telecom applications, it operates b/w 0°C to 70°C with -5V to +5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,408 parts In-Stock

1+ parts

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9,408

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Digiode

USA . 3,247 parts In-Stock

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3,247

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,019 parts In-Stock

1+ parts

$13.268

100+ parts

-

1k+ parts

$13.773

10k+ parts

-

2,019

$13.268

-

$13.773

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$13.739

100+ parts

-

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652

$13.739

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DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$14.610

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-

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1,760

$14.610

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ChromeModa Solutions

Germany . 1,750 parts In-Stock

1+ parts

$14.908

100+ parts

$12.225

1k+ parts

-

10k+ parts

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1,750

$14.908

$12.225

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IDEA Electronic Components Group

UK . 154 parts In-Stock

1+ parts

$14.908

100+ parts

$14.163

1k+ parts

$13.417

10k+ parts

-

154

$14.908

$14.163

$13.417

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Ampacity Inc.

Singapore . 1,551 parts In-Stock

1+ parts

$149.000

100+ parts

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1,551

$149.000

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One Stop Electronics

USA . 1,441 parts In-Stock

1+ parts

$638.000

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1,441

$638.000

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Semicontronic

India . 1,057 parts In-Stock

1+ parts

$849.000

100+ parts

$827.775

1k+ parts

$823.530

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1,057

$849.000

$827.775

$823.530

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Corphita

USA . 3,896 parts In-Stock

1+ parts

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3,896

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Corohmni

South Africa . 237 parts In-Stock

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237

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Overview

Enhance your audio experience with the TCM2913J-00 by Texas Instruments. Crafted with precision using the highest quality materials, this audio codec delivers unparalleled performance and reliability. Whether you're designing a cutting-edge communication system or creating immersive multimedia applications, this product offers unmatched value and benefits. Elevate your projects with the TCM2913J-00 and enjoy crystal-clear sound and seamless functionality like never before. Trust in Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the internal components, making the product reliable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices, optimizing space efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data processing, contributing to improved audio quality.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and compatibility with a wide range of systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in demanding environmental conditions.

Companding Law: A/MU-LAW

A/MU-LAW companding law offers efficient compression and expansion of audio signals, leading to enhanced signal-to-noise ratio.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and consistency in audio processing applications.

Nominal Negative Supply Voltage: -5 V

The negative supply voltage allows for flexible power options and compatibility with various power sources.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and reliable performance of the audio codec.

Filter: YES

Having a filter integrated ensures clean and clear audio output by removing unwanted noise and interference.

Technical Specifications

Audio Codecs TCM2913J-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

24 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM2913J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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