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TLC32044MJB

Texas Instruments

TLC32044MJB by Texas Instruments

TLC32044MJB by Texas Instruments is a 14-bit PCM CODEC with ±5V power supplies, operating from -55 to 125°C. It features synchronous/asynchronous mode and a ceramic, glass-sealed package suitable for military applications. The codec has 28 terminals in an in-line rectangular package style, making it ideal for telecom systems requiring filtering capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,149 parts In-Stock

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3,149

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Vyrian

USA . 3,096 parts In-Stock

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3,096

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Distributors (Availability)

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$5.659

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192

$5.659

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Parana Technologies

USA . 1,491 parts In-Stock

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$10.659

100+ parts

$989.816

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$9.593

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1,491

$10.659

$989.816

$9.593

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DigiPath Technology Company

USA . 2,359 parts In-Stock

1+ parts

$11.736

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2,359

$11.736

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ChromeModa Solutions

Germany . 5,935 parts In-Stock

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$11.976

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$9.820

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5,935

$11.976

$9.820

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$11.976

100+ parts

$11.377

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$10.778

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893

$11.976

$11.377

$10.778

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One Stop Electronics

USA . 712 parts In-Stock

1+ parts

$79.000

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712

$79.000

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A-Z Elektronik GmbH

Germany . 4,769 parts In-Stock

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4,769

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 547 parts In-Stock

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547

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Kepictronics

USA . 206 parts In-Stock

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Overview

Experience crystal-clear audio like never before with the TLC32044MJB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This PCM CODEC is perfect for a wide range of applications, providing superior sound performance with its 14-bit linear coding. Whether you're designing communication systems, telecommunication equipment, or audio processing devices, this MILITARY-grade technology offers unmatched value and benefits. Upgrade your audio experience with the TLC32044MJB today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed package body material ensures durability and reliability, making it suitable for various applications.

Screening Level: 38535Q/M;38534H;883B

This high screening level indicates that the product meets stringent quality and reliability standards, ensuring consistent performance.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The option for both synchronous and asynchronous operation provides flexibility in integration and compatibility with different systems.

Power Supplies (V): +-5

The dual power supply capability at +-5V allows for stable and reliable operation, especially in noise-sensitive audio applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the codec can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, leading to efficient operation and clear audio output.

Technical Specifications

Audio Codecs TLC32044MJB attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

R-GDIP-T28

Linear Coding:

14-BIT

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.715 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TLC32044MJB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-443-7650, 5962014437650, 5962-01-453-9451, 5962014539451

NIIN

014437650, 014539451

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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