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TP3067BN

Texas Instruments

TP3067BN by Texas Instruments

TP3067BN by Texas Instruments is an Audio Codec with +-5V power supplies, A-LAW companding law, and 20 terminals. It operates in synchronous/asynchronous mode and has a temperature range of 0-70°C. Ideal for PCM codec applications in telecom ICs due to its compact rectangular package style.

Median Price

$1.845

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 951 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.560

10k+ parts

$1.460

951

-

$1.740

$1.560

$1.460

Verical

USA . 511 parts In-Stock

1+ parts

-

100+ parts

-

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$1.950

10k+ parts

$1.825

511

-

-

$1.950

$1.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,198 parts In-Stock

1+ parts

$1.834

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$1.834

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Vyrian

USA . 4,744 parts In-Stock

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4,744

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DigiKey Marketplace

USA . 951 parts In-Stock

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951

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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28

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Corel Iberica Componentes, S.L.

Spain . 16 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 95 parts In-Stock

1+ parts

$1.737

100+ parts

-

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95

$1.737

-

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$9.067

100+ parts

$8.251

1k+ parts

$7.435

10k+ parts

-

15

$9.067

$8.251

$7.435

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Parana Technologies

USA . 467 parts In-Stock

1+ parts

$10.719

100+ parts

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$11.206

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467

$10.719

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$11.206

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DigiPath Technology Company

USA . 1,564 parts In-Stock

1+ parts

$11.803

100+ parts

$10.859

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1,564

$11.803

$10.859

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ChromeModa Solutions

Germany . 4,963 parts In-Stock

1+ parts

$12.044

100+ parts

$9.876

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4,963

$12.044

$9.876

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$12.044

100+ parts

$11.442

1k+ parts

$10.840

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1,528

$12.044

$11.442

$10.840

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AZTECH Wire

Italy . 311 parts In-Stock

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$21.380

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Microchip USA

USA . 140 parts In-Stock

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Assy Fe

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Overview

Looking for high-quality audio codecs? Look no further than the TP3067BN by Texas Instruments. With its durable plastic/epoxy package body and synchronous/asynchronous operation mode, this product is perfect for a wide range of applications. From telecommunications to consumer electronics, the TP3067BN provides reliable performance and precise sound quality. Trust in Texas Instruments' reputation for excellence and choose the TP3067BN for all your audio codec needs. Experience the value and benefits that this versatile product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to damage during handling and installation.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating in both synchronous and asynchronous modes allows for compatibility with a wide range of systems and applications.

Power Supplies (V): +-5

The dual power supply option of +-5V allows for stable and reliable operation, ensuring consistent performance of the audio codec.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies integration into existing audio systems, making it a convenient choice for compact designs.

Companding Law: A-LAW

A-Law companding law ensures high-quality audio compression and expansion, optimizing the codec's performance in telecommunication applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the audio codec.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides a standard power input for the codec, making it compatible with common power sources and systems.

Filter: YES

The inclusion of a filter helps minimize noise and distortion in the audio signal, resulting in clear and high-fidelity sound output.

Technical Specifications

Audio Codecs TP3067BN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

24.325 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3067BN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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