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TP3064N

Texas Instruments

TP3064N by Texas Instruments

TP3064N by Texas Instruments is a PCM CODEC with 20 terminals in an IN-LINE package. Operating at -5V to 5V, it features MU-LAW companding law and synchronous/asynchronous mode for audio applications. With a compact size of 26.075mm x 7.62mm x 5.08mm, it's ideal for commercial-grade telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,889 parts In-Stock

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Digiode

USA . 628 parts In-Stock

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628

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Anansix

USA . 516 parts In-Stock

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516

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Electronic Expediters

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$10.108

100+ parts

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362

$10.108

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Parana Technologies

USA . 924 parts In-Stock

1+ parts

$13.820

100+ parts

-

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$14.305

10k+ parts

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924

$13.820

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$14.305

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ChromeModa Solutions

Germany . 2,852 parts In-Stock

1+ parts

$15.528

100+ parts

$12.733

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2,852

$15.528

$12.733

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IDEA Electronic Components Group

UK . 272 parts In-Stock

1+ parts

$15.528

100+ parts

$14.752

1k+ parts

$13.975

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272

$15.528

$14.752

$13.975

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One Stop Electronics

USA . 655 parts In-Stock

1+ parts

$902.000

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655

$902.000

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Corphita

USA . 5,221 parts In-Stock

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5,221

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DigiPath Technology Company

USA . 1,291 parts In-Stock

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$14.000

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1,291

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$14.000

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Kepictronics

USA . 40 parts In-Stock

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40

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Overview

Enhance your audio experience with the TP3064N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Audio Codecs that are perfect for a wide range of applications. Whether you're looking to improve your sound system at home or enhance communication devices, this product offers unmatched value and performance. With its compact design and advanced technology, the TP3064N is the perfect solution for all your audio needs. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable and long-lasting applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations.

No. of Terminals: 20

Sufficient number of terminals to connect various components and enhance functionality.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in different environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high integration, enhancing the efficiency of the product.

Technical Specifications

Audio Codecs TP3064N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3064N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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