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M5156F1

STMicroelectronics

M5156F1 by STMicroelectronics

STMicroelectronics M5156F1 is an Audio Codec with +-5V power supplies, 16 terminals, and A-LAW companding law. It operates b/w 0-70 °C, suitable for PCM CODEC applications in telecom due to its CMOS technology and 5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 13,250 parts In-Stock

1+ parts

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13,250

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Vyrian

USA . 3,375 parts In-Stock

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3,375

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Anansix

USA . 784 parts In-Stock

1+ parts

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784

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Digiode

USA . 520 parts In-Stock

1+ parts

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520

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Tectiva GmbH

Germany . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Corel Iberica Componentes, S.L.

Spain . 56 parts In-Stock

1+ parts

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56

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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LWI Electronics Inc

India . 1 parts In-Stock

1+ parts

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1

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Speed Components Ltd

Israel . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,961 parts In-Stock

1+ parts

$14.398

100+ parts

-

1k+ parts

$12.958

10k+ parts

-

1,961

$14.398

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$12.958

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MKK Technologies

India . 1,018 parts In-Stock

1+ parts

$27.074

100+ parts

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1,018

$27.074

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DigiPath Technology Company

USA . 1,018 parts In-Stock

1+ parts

$27.074

100+ parts

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1,018

$27.074

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Corphita

USA . 1,232 parts In-Stock

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1,232

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Parana Technologies

USA . 128 parts In-Stock

1+ parts

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100+ parts

$17.215

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128

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$17.215

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Assy Fe

Spain . 56 parts In-Stock

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56

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Overview

Discover the innovative M5156F1 by STMicroelectronics, a top-quality audio codec designed to elevate your audio experience. With a sleek ceramic body and advanced CMOS technology, this PCM codec offers crystal-clear sound and reliable performance. Whether you're creating professional-grade audio equipment or developing cutting-edge telecommunications devices, the M5156F1 delivers unparalleled value and versatility. Trust in STMicroelectronics' reputation for excellence and unlock the full potential of your audio projects with the M5156F1.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and high heat resistance, making this codec suitable for rugged environments.

Power Supplies (V): +-5

The dual power supplies provide flexibility in powering the codec, allowing for stable performance in varied voltage conditions.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and suitable for applications where space is a constraint.

Companding Law: A-LAW

A-Law companding is widely used in telecommunication systems, ensuring high-quality audio compression and expansion.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation of the audio codec.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying the integration of this codec in various systems.

Maximum Gain Tolerance: 1.25 dB

The low maximum gain tolerance ensures accurate and consistent audio output, meeting the requirements of demanding audio applications.

Technical Specifications

Audio Codecs M5156F1 attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A-LAW

Filter:

NO

Maximum Gain Tolerance:

1.25 dB

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M5156F1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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