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TLV320AIC13CDBTRG4

Texas Instruments

TLV320AIC13CDBTRG4 by Texas Instruments

TLV320AIC13CDBTRG4 by Texas Instruments is a 30-terminal audio codec with two's complement output/input codes, operating at 1.8-3.3V. It features a small outline package style and dual terminal position, suitable for telecom applications requiring programmable codecs with CMOS technology and synchronous operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,164 parts In-Stock

1+ parts

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5,164

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Digiode

USA . 1,295 parts In-Stock

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1,295

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 632 parts In-Stock

1+ parts

$6.016

100+ parts

-

1k+ parts

$6.791

10k+ parts

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632

$6.016

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$6.791

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DigiPath Technology Company

USA . 1,755 parts In-Stock

1+ parts

$6.625

100+ parts

$6.095

1k+ parts

-

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1,755

$6.625

$6.095

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ChromeModa Solutions

Germany . 5,977 parts In-Stock

1+ parts

$6.760

100+ parts

$5.543

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5,977

$6.760

$5.543

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IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$6.760

100+ parts

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1k+ parts

$6.084

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320

$6.760

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$6.084

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Advanced Electronics

New Zealand . 68 parts In-Stock

1+ parts

$11.457

100+ parts

$10.426

1k+ parts

$9.395

10k+ parts

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68

$11.457

$10.426

$9.395

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AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$19.152

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592

$19.152

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One Stop Electronics

USA . 974 parts In-Stock

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$290.000

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974

$290.000

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Corphita

USA . 925 parts In-Stock

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925

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Overview

Experience unparalleled audio quality with the TLV320AIC13CDBTRG4 by Texas Instruments, a leading manufacturer in the industry. As part of the Audio Codecs category, this product offers exceptional value and benefits for various applications. Whether you're designing consumer electronics, telecommunications equipment, or professional audio systems, the TLV320AIC13CDBTRG4 provides superior performance and reliability. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your audio experience today with the TLV320AIC13CDBTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and ensures the safety of the internal components.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and reducing assembly time.

Output Code: TWOS COMPLEMENT

The two's complement output code ensures accurate representation of digital signals, leading to high-quality audio output.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space on the circuit board, enabling compact design.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and synchronization, resulting in reliable audio processing.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages provides flexibility in different operating environments and compatibility with various systems.

No. of Terminals: 30

The numerous terminals allow for versatile connectivity options and enable complex audio signal processing capabilities.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Output Voltage: 2.35 V

The high maximum output voltage ensures strong and clear audio signals, suitable for a wide range of audio applications.

Resolution (um): 16

The high resolution of 16 um enables precise signal processing and accurate representation of audio data, resulting in high-fidelity sound output.

Technical Specifications

Audio Codecs TLV320AIC13CDBTRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC13CDBTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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