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LC07422T

Onsemi

LC07422T by Onsemi

LC07422T by Onsemi is a 64-terminal PCM CODEC with synchronous operation. It features a thin profile flatpack package, 0.5mm terminal pitch, and includes a filter. Ideal for telecom applications requiring 2.8V supply voltage and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,716 parts In-Stock

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1,716

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Digiode

USA . 71 parts In-Stock

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,498 parts In-Stock

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6,498

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Problanco Electronics

Mexico . 5,563 parts In-Stock

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5,563

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SupplyDigital Components

Austria . 5,335 parts In-Stock

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5,335

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Kulean Microsystems

USA . 3,684 parts In-Stock

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3,684

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Corohmni

South Africa . 467 parts In-Stock

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467

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Corphita

USA . 280 parts In-Stock

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280

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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Overview

Upgrade your audio experience with the LC07422T from Onsemi, a leading manufacturer known for high-quality products. This Audio Codec is perfect for a variety of applications, offering seamless synchronization and a sleek design. With 64 terminals in a compact package, this product delivers exceptional performance while maintaining a slim profile. Elevate your audio projects with the LC07422T and enjoy the value, benefits, and advantages that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and reducing assembly time.

Package Shape: SQUARE

Compact square shape allows for efficient use of space on the circuit board.

Operating Mode: SYNCHRONOUS

Enables precise synchronization of data transmission, ensuring high-quality audio output.

No. of Terminals: 64

Sufficient number of terminals for connecting various components and interfaces, providing versatility in use.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Sleek and slim design with fine pitch terminals for a modern and compact form factor.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connection on the circuit board.

Maximum Seated Height: 1.2 mm

Low profile design helps in saving space and reducing overall height of the product.

Width: 10 mm

Compact width for efficient use of space on the circuit board.

Length: 10 mm

Compact length for efficient use of space on the circuit board.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connection during operation.

Telecom IC Type: PCM CODEC

Designed specifically for telecom applications, providing high-quality audio encoding and decoding.

Nominal Supply Voltage: 2.8 V

Optimal supply voltage for efficient performance and reliable operation of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and reduced signal interference.

Filter: YES

Built-in filter helps in reducing noise and ensuring clean audio output.

Technical Specifications

Audio Codecs LC07422T attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Filter:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Operating Mode:

SYNCHRONOUS

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LC07422T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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