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TP3057BFNR

Texas Instruments

TP3057BFNR by Texas Instruments

TP3057BFNR by Texas Instruments is a PCM CODEC with A-LAW companding law. It operates in synchronous/asynchronous mode, has 20 terminals, and supports filter. This audio codec is ideal for telecom applications due to its commercial temperature grade and -5V to 5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,926 parts In-Stock

1+ parts

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1k+ parts

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4,926

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Vyrian

USA . 1,981 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$7.766

100+ parts

-

1k+ parts

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10k+ parts

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459

$7.766

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Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

$8.343

100+ parts

-

1k+ parts

$8.970

10k+ parts

-

1,762

$8.343

-

$8.970

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DigiPath Technology Company

USA . 480 parts In-Stock

1+ parts

$9.187

100+ parts

$8.452

1k+ parts

-

10k+ parts

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480

$9.187

$8.452

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ChromeModa Solutions

Germany . 1,715 parts In-Stock

1+ parts

$9.374

100+ parts

$7.687

1k+ parts

-

10k+ parts

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1,715

$9.374

$7.687

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

1+ parts

$9.374

100+ parts

$8.905

1k+ parts

$8.437

10k+ parts

-

1,166

$9.374

$8.905

$8.437

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One Stop Electronics

USA . 480 parts In-Stock

1+ parts

$264.000

100+ parts

-

1k+ parts

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10k+ parts

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480

$264.000

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Corphita

USA . 2,676 parts In-Stock

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2,676

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Overview

Enhance your audio experience with the TP3057BFNR by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a leading player in the Audio Codecs category, this chip carrier package offers synchronous/asynchronous operation with A-law companding law for optimal performance. Perfect for telecom applications, this PCM codec delivers crystal-clear sound with a nominal supply voltage of 5V and maximum supply current of 9mA. Trust Texas Instruments to bring innovation and value to your audio projects with the TP3057BFNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, suitable for portable audio applications.

Surface Mount: YES

Allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the circuit board.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports both synchronous and asynchronous operation, providing flexibility in different audio codec applications.

No. of Terminals: 20

Sufficient number of terminals for connecting various audio input and output signals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style ensures better thermal performance and reliability in operation.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without performance degradation, suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without impact on functionality.

Terminal Position: QUAD

Quad terminal position allows for easier connections and routing on the PCB.

Maximum Seated Height: 4.57 mm

Low seated height allows for compact design and integration into space-constrained audio devices.

Width: 8.9662 mm

Narrow width facilitates placement on the PCB with other components for efficient board layout.

Companding Law: A-LAW

A-Law companding law provides high-quality audio compression and expansion for improved signal-to-noise ratio.

Length: 8.9662 mm

Compact length ensures minimal footprint on the PCB, ideal for small form factor audio devices.

Temperature Grade: COMMERCIAL

Commercial grade temperature rating suitable for standard operating environments in consumer electronics.

Nominal Negative Supply Voltage: -5 V

Negative supply voltage support for proper signal processing and powering of the audio codec.

Terminal Form: J BEND

J Bend terminal form allows for easy and secure soldering connections on the PCB.

Maximum Supply Current: 9 mA

Low maximum supply current for power-efficient operation in audio codec applications.

Telecom IC Type: PCM CODEC

PCM codec specifically designed for telecommunications applications, ensuring high-quality voice transmission.

Nominal Supply Voltage: 5 V

Stable and standard nominal supply voltage for consistent performance in audio processing.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and board placement, enhancing manufacturing efficiency.

Filter: YES

Includes a filter for signal processing and noise reduction, delivering clear and crisp audio output.

Technical Specifications

Audio Codecs TP3057BFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3057BFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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