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TCM129C14AJ

Texas Instruments

TCM129C14AJ by Texas Instruments

TCM129C14AJ by Texas Instruments is an Audio Codec with +-5V power supplies, 24 terminals, and companding law A/MU-LAW. Ideal for telecom applications due to PCM CODEC type, industrial temperature grade, and CMOS technology ensuring reliable performance in a wide range of temperatures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,143 parts In-Stock

1+ parts

-

100+ parts

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9,143

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Digiode

USA . 1,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,475

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LWI Electronics Inc

India . 30 parts In-Stock

1+ parts

-

100+ parts

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,438 parts In-Stock

1+ parts

$10.312

100+ parts

-

1k+ parts

$10.836

10k+ parts

-

1,438

$10.312

-

$10.836

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$11.172

100+ parts

-

1k+ parts

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10k+ parts

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639

$11.172

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DigiPath Technology Company

USA . 716 parts In-Stock

1+ parts

$11.355

100+ parts

$10.447

1k+ parts

-

10k+ parts

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716

$11.355

$10.447

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ChromeModa Solutions

Germany . 1,385 parts In-Stock

1+ parts

$11.587

100+ parts

$9.501

1k+ parts

-

10k+ parts

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1,385

$11.587

$9.501

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IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$11.587

100+ parts

$11.008

1k+ parts

$10.428

10k+ parts

-

418

$11.587

$11.008

$10.428

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One Stop Electronics

USA . 427 parts In-Stock

1+ parts

$166.000

100+ parts

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427

$166.000

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Corphita

USA . 1,268 parts In-Stock

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1,268

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Overview

Enhance your audio applications with the high-quality TCM129C14AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch performance and reliability. This PCM CODEC offers exceptional value with its industrial-grade temperature range and companding law features, making it ideal for telecom applications. With its compact rectangular design and easy-to-install through-hole terminals, the TCM129C14AJ provides unmatched convenience and versatility. Elevate your audio projects with this advanced audio codec from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and reliability, making the product suitable for industrial applications where temperature fluctuations are common.

Power Supplies (V): +-5

Wide power supply range allows compatibility with various systems and ensures stable operation even with slight voltage fluctuations.

No. of Terminals: 24

Having a high number of terminals allows for versatile connectivity options and integration within complex electronic systems.

Companding Law: A/MU-LAW

Support for A-law and mu-law companding laws ensures compatibility with telecommunication systems using different companding algorithms.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to operate reliably in harsh environmental conditions without performance degradation.

Technical Specifications

Audio Codecs TCM129C14AJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-XDIP-T24

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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