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S3507I-C

Onsemi

S3507I-C by Onsemi

S3507I-C by Onsemi is an audio codec with 22 terminals, operating in synchronous mode. It features companding law MU-LAW and operates at industrial temperature grade. This PCM codec has a nominal voltage of 5V and is suitable for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,570 parts In-Stock

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Vyrian

USA . 1,517 parts In-Stock

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1,517

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Kulean Microsystems

USA . 3,646 parts In-Stock

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Corphita

USA . 2,215 parts In-Stock

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TANS Electronics

Latvia . 1,006 parts In-Stock

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Problanco Electronics

Mexico . 962 parts In-Stock

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SupplyDigital Components

Austria . 810 parts In-Stock

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UHIMA Technologies

Türkiye . 392 parts In-Stock

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Corohmni

South Africa . 237 parts In-Stock

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Overview

Enhance your audio experience with the S3507I-C by Onsemi, a top-quality PCM CODEC designed to deliver crystal-clear sound in various applications. Manufactured by Onsemi, a trusted name in the industry, this product boasts a ceramic, metal-sealed co-fired body for enhanced durability and reliability. Ideal for telecom applications, this synchronous-operating codec offers a companding law of MU-LAW, ensuring optimal performance in industrial-grade temperatures. Invest in the S3507I-C today and enjoy the benefits of superior sound quality and seamless functionality for all your audio needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials provides durability and reliability, making this product suitable for harsh operating conditions.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures accurate data transmission and synchronization, making it ideal for applications requiring precise timing.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage offers compatibility with standard power sources, making integration into existing systems easier.

Filter: YES

The presence of a filter helps in noise reduction and signal clarity, resulting in high-quality audio output.

Technical Specifications

Audio Codecs S3507I-C attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-CDIP-T22

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

22

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

S3507I-C Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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