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TLC32045CFNR

Texas Instruments

TLC32045CFNR by Texas Instruments

TLC32045CFNR by Texas Instruments is a PCM CODEC with 28 terminals, operating at -5V to 5V. It features synchronous/asynchronous mode, chip carrier package style, and operates in commercial temperature range. Ideal for audio applications requiring filter technology in telecom equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,905 parts In-Stock

1+ parts

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6,905

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Digiode

USA . 1,487 parts In-Stock

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1,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 646 parts In-Stock

1+ parts

$10.663

100+ parts

-

1k+ parts

$11.153

10k+ parts

-

646

$10.663

-

$11.153

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DigiPath Technology Company

USA . 1,289 parts In-Stock

1+ parts

$11.741

100+ parts

-

1k+ parts

-

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1,289

$11.741

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ChromeModa Solutions

Germany . 6,507 parts In-Stock

1+ parts

$11.981

100+ parts

$9.824

1k+ parts

-

10k+ parts

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6,507

$11.981

$9.824

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$11.981

100+ parts

$11.382

1k+ parts

$10.783

10k+ parts

-

400

$11.981

$11.382

$10.783

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AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$19.216

100+ parts

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620

$19.216

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One Stop Electronics

USA . 1,033 parts In-Stock

1+ parts

$696.000

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1,033

$696.000

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Corphita

USA . 3,246 parts In-Stock

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3,246

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Overview

Enhance the audio experience with the Texas Instruments TLC32045CFNR Audio Codec, a top-quality product from a trusted manufacturer. Ideal for a wide range of applications, this device offers unparalleled value and benefits to customers seeking high-quality sound solutions. From its innovative technology to its commercial-grade performance, the TLC32045CFNR delivers superior audio performance with ease. Experience the difference with this versatile and reliable audio codec from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the audio codec, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for manufacturing processes.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation depending on the specific requirements of the audio system, allowing for versatile use.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components in the audio system, enhancing functionality.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in high-temperature environments, making it reliable for various applications.

Temperature Grade: COMMERCIAL

Suitable for commercial use and ensures compatibility with standard operating conditions in commercial settings.

Technology: CMOS

Uses CMOS technology, known for low power consumption and high noise immunity, enhancing energy efficiency and performance.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it compatible with common power sources and easy to integrate into existing systems.

Filter: YES

Includes a filter to improve audio signal quality by reducing noise and interference, resulting in clear and high-fidelity sound output.

Technical Specifications

Audio Codecs TLC32045CFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

TLC32045CFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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