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TCM29C17N-00

Texas Instruments

TCM29C17N-00 by Texas Instruments

Texas Instruments TCM29C17N-00 is a PCM CODEC with A-LAW companding law. Operating at -5V to 5V, it has 16 terminals in a rectangular package suitable for telecom applications. With synchronous operation and a filter, it offers high-quality audio encoding/decoding capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,279 parts In-Stock

1+ parts

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3,279

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Digiode

USA . 2,327 parts In-Stock

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2,327

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$6.787

100+ parts

-

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582

$6.787

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Parana Technologies

USA . 1,968 parts In-Stock

1+ parts

$15.728

100+ parts

-

1k+ parts

$16.091

10k+ parts

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1,968

$15.728

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$16.091

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DigiPath Technology Company

USA . 2,353 parts In-Stock

1+ parts

$17.319

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2,353

$17.319

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ChromeModa Solutions

Germany . 4,291 parts In-Stock

1+ parts

$17.672

100+ parts

$14.491

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4,291

$17.672

$14.491

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IDEA Electronic Components Group

UK . 1,585 parts In-Stock

1+ parts

$17.672

100+ parts

$16.788

1k+ parts

$15.905

10k+ parts

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1,585

$17.672

$16.788

$15.905

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One Stop Electronics

USA . 425 parts In-Stock

1+ parts

$788.000

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425

$788.000

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Corphita

USA . 2,052 parts In-Stock

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2,052

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Overview

Elevate your audio experience with the TCM29C17N-00 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their audio codecs. Perfect for a wide range of applications, this PCM codec offers unmatched value and benefits to customers looking for crystal-clear sound and seamless operation. Upgrade your audio system today with the TCM29C17N-00 and experience the difference Texas Instruments can make in your sound quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the audio codec, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transmission, resulting in high-quality audio output.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and compatibility with various systems and devices.

Temperature Grade: COMMERCIAL

Suitable for commercial use, this audio codec can operate efficiently within a temperature range of 0-70°C.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures stable power delivery to the codec, optimizing its performance and reliability.

Filter: YES

Having a filter helps in reducing noise and interference, resulting in clearer and distortion-free audio output.

Technical Specifications

Audio Codecs TCM29C17N-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C17N-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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