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TP13064AJ

Texas Instruments

TP13064AJ by Texas Instruments

TP13064AJ by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and companding law MU-LAW. It operates in industrial temperature range and features a filter. Ideal for PCM CODEC applications requiring -5V to 5V supply voltage with 2.54mm terminal pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,040

-

-

-

-

Digiode

USA . 3,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,152

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$5.269

100+ parts

-

1k+ parts

-

10k+ parts

-

749

$5.269

-

-

-

Parana Technologies

USA . 292 parts In-Stock

1+ parts

$6.633

100+ parts

-

1k+ parts

$7.353

10k+ parts

-

292

$6.633

-

$7.353

-

DigiPath Technology Company

USA . 1,263 parts In-Stock

1+ parts

$7.304

100+ parts

$6.720

1k+ parts

-

10k+ parts

-

1,263

$7.304

$6.720

-

-

ChromeModa Solutions

Germany . 6,242 parts In-Stock

1+ parts

$7.453

100+ parts

$6.111

1k+ parts

-

10k+ parts

-

6,242

$7.453

$6.111

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-

IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$7.453

100+ parts

-

1k+ parts

$6.708

10k+ parts

-

275

$7.453

-

$6.708

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One Stop Electronics

USA . 1,493 parts In-Stock

1+ parts

$377.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,493

$377.000

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-

-

Corphita

USA . 395 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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395

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Overview

Experience superior audio quality with the TP13064AJ by Texas Instruments, a leading manufacturer known for reliable and innovative products. As part of the Audio Codecs category, this product offers exceptional value and benefits for various applications. From telecommunication to consumer electronics, the TP13064AJ provides clear and crisp sound reproduction with its advanced technology and industrial-grade components. Trust Texas Instruments for top-notch performance and reliability in every use.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package offers high reliability and durability, making the product suitable for long-term usage in various environments.

Power Supplies (V): +-5

Dual power supplies with a range of +-5V provide stable and sufficient power for the codec to operate efficiently.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration in existing setups and circuit layouts, enhancing the overall convenience of installation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, resulting in reliable and efficient performance of the audio codec.

Filter: YES

Presence of a filter ensures that unwanted noise and interference are minimized, resulting in clear and high-quality audio output.

Technical Specifications

Audio Codecs TP13064AJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-XDIP-T20

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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