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TP3070V

Texas Instruments

TP3070V by Texas Instruments

TP3070V by Texas Instruments is a 28-terminal audio codec chip carrier with synchronous operation. It features companding law A/MU-LAW, operates at -5V to 5V supply voltage, and has a temperature range of 0-70°C. Ideal for telecom applications requiring programmable codecs in a compact square package.

Median Price

$14.210

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 151 parts In-Stock

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$14.210

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Vyrian

USA . 6,605 parts In-Stock

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Digiode

USA . 3,410 parts In-Stock

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Anansix

USA . 2,198 parts In-Stock

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ComSIT Distribution GmbH

Germany . 119 parts In-Stock

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ECAB

Sweden . 25 parts In-Stock

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Vectronix, Inc

USA . 22 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 18 parts In-Stock

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Q Components

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Distributors (Availability)

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AZTECH Wire

Italy . 471 parts In-Stock

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$7.279

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Parana Technologies

USA . 751 parts In-Stock

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$11.727

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$12.123

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751

$11.727

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ChromeModa Solutions

Germany . 2,713 parts In-Stock

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$13.176

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$10.804

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IDEA Electronic Components Group

UK . 1,186 parts In-Stock

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$13.176

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$12.517

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$11.858

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One Stop Electronics

USA . 1,270 parts In-Stock

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$509.000

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DigiPath Technology Company

USA . 2,141 parts In-Stock

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$11.879

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 322 parts In-Stock

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Overview

Experience unparalleled audio quality with the TP3070V by Texas Instruments, a top-tier manufacturer of cutting-edge audio codecs. This versatile chip carrier boasts a wide range of applications, from telecommunications to consumer electronics. Offering a commercial temperature grade and a compact square package shape, the TP3070V guarantees optimal performance in any operating mode. Trust in Texas Instruments to deliver exceptional value and benefits with this programmable codec, providing customers with unmatched advantages in their audio projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the audio codec, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the audio codec on circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures synchronized data transmission, which is crucial for maintaining high-quality audio output without delays or interruptions.

No. of Terminals: 28

Having 28 terminals provides flexibility and connectivity options for integrating the audio codec with other components in a system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in warm operating environments.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage allows for compatibility with a wide range of power sources, making it versatile for different applications.

Filter: YES

Having a filter included in the audio codec helps to enhance audio quality by reducing noise and improving signal clarity.

Technical Specifications

Audio Codecs TP3070V attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.43 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

TP3070V Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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