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TLV320AIC3106IZQER

Texas Instruments

TLV320AIC3106IZQER by Texas Instruments

TLV320AIC3106IZQER by Texas Instruments is an Audio Codec with 2 channels, operating in industrial temperature range. It features TWOS COMPLEMENT output/input codes and supports PCM CODEC telecom IC type. Ideal for applications requiring synchronous operation and fine pitch grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 67,000 parts In-Stock

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Vyrian

USA . 8,979 parts In-Stock

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8,979

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Digiode

USA . 3,962 parts In-Stock

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3,962

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R&J Components

USA . 863 parts In-Stock

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863

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Distributors (Availability)

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Parana Technologies

USA . 446 parts In-Stock

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$12.024

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$12.430

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446

$12.024

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$12.430

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One Stop Electronics

USA . 1,601 parts In-Stock

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$13.000

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1,601

$13.000

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ChromeModa Solutions

Germany . 2,088 parts In-Stock

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$13.510

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$11.078

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2,088

$13.510

$11.078

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IDEA Electronic Components Group

UK . 498 parts In-Stock

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$13.510

100+ parts

$12.834

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$12.159

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498

$13.510

$12.834

$12.159

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AZTECH Wire

Italy . 754 parts In-Stock

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$19.443

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Assy Fe

Spain . 277,500 parts In-Stock

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Perfect Parts

USA . 14,943 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,164 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 4,644 parts In-Stock

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Corphita

USA . 3,277 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,899 parts In-Stock

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$12.181

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1,899

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$12.181

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Lixinc

USA . 771 parts In-Stock

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Microchip USA

USA . 430 parts In-Stock

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430

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Overview

Elevate your audio experience with the TLV320AIC3106IZQER by Texas Instruments, a top-of-the-line Audio Codec designed to deliver unparalleled sound quality and performance. Crafted by a trusted manufacturer in the industry, this product is perfect for a wide range of applications, from consumer electronics to industrial settings. With its advanced features and reliable design, the TLV320AIC3106IZQER offers customers exceptional value, benefits, and advantages that will take their audio projects to the next level. Upgrade your audio game today with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and helps protect the internal components of the audio codec.

Surface Mount: YES

Being surface mountable makes this audio codec easy to integrate into circuit boards, saving space and simplifying assembly.

Output Code: TWOS COMPLEMENT

The use of twos complement output code ensures accurate and efficient signal processing in the audio codec.

Package Shape: SQUARE

The square package shape allows for efficient placement and routing on circuit boards, optimizing space usage.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise synchronization between input and output signals in the audio codec.

No. of Terminals: 80

With a high number of terminals, this audio codec can support multiple connectivity options and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables high-density mounting and improves overall performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability of the audio codec in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the audio codec to function effectively even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the audio codec.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure connections in the audio codec's installation.

Output (V): VOLTAGE

The voltage output signal provides compatibility with various audio devices and systems, ensuring seamless integration.

Maximum Seated Height: 1 mm

The low seated height profile enables the audio codec to fit in compact spaces without compromising performance.

Width: 5 mm

The 5mm width of the audio codec contributes to its slim and compact design, ideal for applications with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

The quick reflow time of 30 seconds ensures efficient and reliable soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure solder joints and robust connections for the audio codec.

Length: 5 mm

The 5mm length dimension contributes to the compact form factor of the audio codec, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the audio codec can withstand harsh operating conditions and industrial environments.

No. of Channels: 2

The 2-channel capability provides flexibility for stereo audio processing and output in the audio codec.

Terminal Form: BALL

The ball terminal form offers secure connections and reliable performance in the audio codec's installation and operation.

Telecom IC Type: PCM CODEC

The use of PCM codec technology in this audio codec ensures high-quality voice and audio encoding and decoding for telecommunications applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V results in lower power consumption and efficient operation of the audio codec.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and precise connections, enhancing the audio codec's performance and reliability.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the audio codec can withstand moderate exposure to moisture during handling and storage.

Input Type: SINGLE-ENDED/DIFF

The choice of single-ended or differential input types provides versatility for connecting different audio sources to the codec.

Filter: YES

The built-in filter feature helps to remove unwanted noise and interference from the audio signal, ensuring clear and high-fidelity output.

Technical Specifications

Audio Codecs TLV320AIC3106IZQER attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC3106IZQER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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