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TP3070J

Texas Instruments

TP3070J by Texas Instruments

TP3070J by Texas Instruments is a 28-terminal audio codec with synchronous operation. It features companding law A/MU-LAW, operates at -5V to 5V supply voltage, and has a rectangular package style. Ideal for telecom applications requiring programmable codecs, it offers a filter and operates in commercial temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,324 parts In-Stock

1+ parts

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6,324

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Digiode

USA . 4,606 parts In-Stock

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4,606

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Anansix

USA . 196 parts In-Stock

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196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,736 parts In-Stock

1+ parts

$6.024

100+ parts

-

1k+ parts

$6.798

10k+ parts

-

1,736

$6.024

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$6.798

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DigiPath Technology Company

USA . 2,229 parts In-Stock

1+ parts

$6.634

100+ parts

$6.103

1k+ parts

-

10k+ parts

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2,229

$6.634

$6.103

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ChromeModa Solutions

Germany . 3,539 parts In-Stock

1+ parts

$6.769

100+ parts

$5.551

1k+ parts

-

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3,539

$6.769

$5.551

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IDEA Electronic Components Group

UK . 857 parts In-Stock

1+ parts

$6.769

100+ parts

-

1k+ parts

$6.092

10k+ parts

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857

$6.769

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$6.092

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$14.875

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703

$14.875

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One Stop Electronics

USA . 720 parts In-Stock

1+ parts

$767.000

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720

$767.000

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Corphita

USA . 3,718 parts In-Stock

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3,718

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Overview

Elevate your audio experience with the TP3070J by Texas Instruments, a premium quality audio codec designed to deliver superior sound performance. From the renowned manufacturer, Texas Instruments, this versatile product is perfect for a variety of applications in the telecom industry. With its advanced features and reliable functionality, the TP3070J offers customers exceptional value, benefits, and advantages that will enhance their audio systems. Upgrade your audio technology today with the TP3070J and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package provides durability and protection for the internal components, ensuring reliable performance even in harsh environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and data synchronization, ideal for applications where timing accuracy is crucial.

No. of Terminals: 28

Having 28 terminals allows for multiple connection options and flexibility in system integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable operation even under challenging thermal conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and a backup connection option, enhancing the reliability of the product.

Technical Specifications

Audio Codecs TP3070J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T28

Length:

37.846 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.715 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TP3070J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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