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TP3064WM

Texas Instruments

TP3064WM by Texas Instruments

TP3064WM by Texas Instruments is an Audio Codec with 20 terminals, operating in synchronous/asynchronous mode. It features companding law μ-law and operates at temperatures b/w 0-70°C. Ideal for PCM codec applications, this small outline package has a gull wing terminal form and supports surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Mil-Aero Solutions, Inc.

USA . 7,391 parts In-Stock

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Vyrian

USA . 2,993 parts In-Stock

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2,993

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Digiode

USA . 2,462 parts In-Stock

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2,462

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Bristol Electronics

USA . 157 parts In-Stock

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157

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Anansix

USA . 138 parts In-Stock

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138

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PC Components Company LLC

USA . 78 parts In-Stock

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78

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Atlantic Semiconductor

USA . 36 parts In-Stock

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36

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EMSNET

USA . 31 parts In-Stock

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R&J Components

USA . 27 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,287 parts In-Stock

1+ parts

$5.699

100+ parts

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$6.493

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2,287

$5.699

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$6.493

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DigiPath Technology Company

USA . 243 parts In-Stock

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$6.275

100+ parts

$5.773

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243

$6.275

$5.773

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ChromeModa Solutions

Germany . 3,610 parts In-Stock

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$6.403

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$5.250

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3,610

$6.403

$5.250

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IDEA Electronic Components Group

UK . 586 parts In-Stock

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$6.403

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$5.763

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586

$6.403

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$5.763

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AZTECH Wire

Italy . 612 parts In-Stock

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$18.580

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612

$18.580

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One Stop Electronics

USA . 834 parts In-Stock

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$657.000

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834

$657.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,054 parts In-Stock

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Metaverse IC Inc.

Canada . 19,500 parts In-Stock

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Microchip USA

USA . 4,946 parts In-Stock

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4,946

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Corphita

USA . 2,969 parts In-Stock

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2,969

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Perfect Parts

USA . 1,101 parts In-Stock

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Kepictronics

USA . 812 parts In-Stock

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812

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Experience top-quality audio performance with the TP3064WM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for Audio Codecs. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. Upgrade your audio experience today with the TP3064WM and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations and requirements.

No. of Terminals: 20

Having 20 terminals allows for connectivity with multiple components and peripherals, enhancing the functionality of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in varying environmental conditions.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards and is suitable for a wide range of applications.

Technical Specifications

Audio Codecs TP3064WM attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8015 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.642 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.493 mm

Trade Compliance

TP3064WM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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