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TCM129C16J-00

Texas Instruments

TCM129C16J-00 by Texas Instruments

Texas Instruments TCM129C16J-00 is an audio codec with 16 terminals, operating in synchronous mode. It features a companding law of MU-LAW and operates at industrial temperature grades. This PCM CODEC has a nominal voltage of 5V and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,443 parts In-Stock

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8,443

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Digiode

USA . 1,078 parts In-Stock

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1,078

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Distributors (Availability)

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AZTECH Wire

Italy . 892 parts In-Stock

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$7.994

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892

$7.994

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Parana Technologies

USA . 1,767 parts In-Stock

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$8.819

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-

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$9.505

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1,767

$8.819

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$9.505

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DigiPath Technology Company

USA . 1,223 parts In-Stock

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$9.711

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1,223

$9.711

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ChromeModa Solutions

Germany . 1,773 parts In-Stock

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$9.909

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$8.125

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1,773

$9.909

$8.125

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IDEA Electronic Components Group

UK . 924 parts In-Stock

1+ parts

$9.909

100+ parts

$9.414

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$8.918

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924

$9.909

$9.414

$8.918

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One Stop Electronics

USA . 452 parts In-Stock

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$83.000

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452

$83.000

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Semicontronic

India . 1,571 parts In-Stock

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$732.000

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$713.700

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$710.040

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1,571

$732.000

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Ampacity Inc.

Singapore . 698 parts In-Stock

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$835.000

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698

$835.000

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Corphita

USA . 3,882 parts In-Stock

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Corohmni

South Africa . 60 parts In-Stock

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Overview

Enhance your audio applications with the TCM129C16J-00 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This PCM CODEC is designed to deliver exceptional performance and precision, making it ideal for a wide range of audio codecs applications. With its industrial temperature grade, compact design, and low supply voltage, this product offers unmatched value and benefits to customers seeking high-quality audio solutions. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and protection for the internal components, making this product suitable for long-term use in various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably even in hot conditions, making it versatile for different applications.

Companding Law: MU-LAW

The MU-LAW companding law ensures efficient compression and expansion of audio signals, resulting in high-quality sound reproduction with minimal distortion.

Telecom IC Type: PCM CODEC

The use of PCM CODEC technology in the telecom IC type ensures accurate digital-to-analog conversion, making this product ideal for telecommunications and audio processing.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage provides a stable power source for the product, ensuring consistent performance and signal quality.

Technical Specifications

Audio Codecs TCM129C16J-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM129C16J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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