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S3507AI-CLCCC

Onsemi

S3507AI-CLCCC by Onsemi

S3507AI-CLCCC by Onsemi is a PCM CODEC chip carrier with 28 terminals. Operating in synchronous mode, it has a companding law of MU-LAW and operates b/w -40 to 85 °C. Ideal for telecom applications requiring audio codecs in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,537 parts In-Stock

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Digiode

USA . 1,134 parts In-Stock

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Kulean Microsystems

USA . 5,311 parts In-Stock

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Problanco Electronics

Mexico . 5,259 parts In-Stock

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SupplyDigital Components

Austria . 2,858 parts In-Stock

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Corphita

USA . 1,910 parts In-Stock

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TANS Electronics

Latvia . 1,865 parts In-Stock

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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Corohmni

South Africa . 217 parts In-Stock

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Overview

Elevate your audio experience with the S3507AI-CLCCC by Onsemi, a top-of-the-line Audio Codec that sets the standard for quality and performance. Designed by a trusted manufacturer in the industry, this chip carrier package offers a wide range of applications for seamless integration into your projects. With a focus on delivering value and convenience to customers, this PCM Codec boasts industrial-grade temperature tolerance, companding law features, and a compact square shape for easy mounting. Upgrade your audio solutions today with the S3507AI-CLCCC and enjoy unparalleled benefits and advantages that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and reliability for the audio codec, making it a good choice for rugged industrial applications.

Surface Mount: YES

Being surface mountable, this audio codec can be easily integrated into circuit boards, offering convenience in assembly and saving space.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise synchronization and timing within the codec, resulting in accurate audio processing and high performance.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for compact and efficient packaging of the audio codec, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade range of -40 to 85 °C, this audio codec can withstand harsh environmental conditions, making it ideal for industrial settings.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides compatibility with standard power systems, ensuring ease of integration and operation in various electronic devices.

Companding Law: MU-LAW

The use of Mu-law companding law allows for efficient compression and expansion of audio signals, improving dynamic range and signal-to-noise ratio in the codec.

Filter: YES

The presence of a filter in the codec helps in improving signal quality by removing unwanted noise and interference, resulting in clear and crisp audio output.

Technical Specifications

Audio Codecs S3507AI-CLCCC attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-CQCC-N28

Length:

11.4935 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4935 mm

Trade Compliance

S3507AI-CLCCC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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