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S3507I

Onsemi

S3507I by Onsemi

The Onsemi S3507I is a PCM CODEC with SYNCHRONOUS operation, -40 to 85 °C temp range, and MU-LAW companding. Ideal for telecom applications requiring IN-LINE package style and CMOS technology for audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,528 parts In-Stock

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Digiode

USA . 1,337 parts In-Stock

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1,337

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,884 parts In-Stock

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TANS Electronics

Latvia . 6,469 parts In-Stock

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Kulean Microsystems

USA . 5,096 parts In-Stock

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Problanco Electronics

Mexico . 2,626 parts In-Stock

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Corphita

USA . 2,139 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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UHIMA Technologies

Türkiye . 48 parts In-Stock

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Overview

Elevate your audio experience with the S3507I by Onsemi, a top-quality PCM CODEC designed for industrial applications. Manufactured with precision and expertise, this IN-LINE rectangular package ensures optimal performance in any operating environment. With synchronous operation and companding law, this telecom IC offers unparalleled sound quality and reliability. Say goodbye to subpar audio with the S3507I - the perfect solution for all your industrial audio needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this audio codec suitable for harsh environments.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and synchronization, making it ideal for applications where timing accuracy is crucial.

No. of Terminals: 22

With 22 terminals, this audio codec offers versatile connectivity options and allows for integration with various systems and devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in potentially high-temperature environments.

Companding Law: MU-LAW

The use of MU-LAW companding law ensures efficient compression and expansion of audio signals, resulting in high-quality audio output.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power to the audio codec, ensuring consistent performance and reliable operation.

Telecom IC Type: PCM CODEC

Being a PCM codec specifically designed for telecom applications, this audio codec is optimized for efficient voice signal processing in telecommunications systems.

Technical Specifications

Audio Codecs S3507I attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T22

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

22

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

S3507I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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