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S3507AI

Onsemi

S3507AI by Onsemi

The Onsemi S3507AI is a PCM CODEC chip carrier with 28 terminals, operating in synchronous mode. It features companding law MU-LAW and operates b/w -40 to 85 °C. Ideal for telecom applications, this audio codec has a plastic/epoxy body and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,007 parts In-Stock

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2,007

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Digiode

USA . 309 parts In-Stock

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309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,729 parts In-Stock

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7,729

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TANS Electronics

Latvia . 7,240 parts In-Stock

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7,240

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Kulean Microsystems

USA . 2,546 parts In-Stock

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2,546

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SupplyDigital Components

Austria . 1,647 parts In-Stock

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1,647

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Corphita

USA . 1,332 parts In-Stock

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1,332

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UHIMA Technologies

Türkiye . 658 parts In-Stock

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658

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Corohmni

South Africa . 200 parts In-Stock

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200

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Overview

Unleash the power of crystal-clear audio with the S3507AI by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their Audio Codecs. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. Experience seamless communication, superior sound quality, and innovative technology with the S3507AI. Trust Onsemi to elevate your audio experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and resilience, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures accurate and synchronized data processing, leading to improved performance and reliability.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, enhancing overall efficiency and stability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard power requirement, making it compatible with a wide range of systems and applications.

Filter: YES

The inclusion of a filter in the product ensures clear and precise audio output, improving the overall sound quality and user experience.

Technical Specifications

Audio Codecs S3507AI attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-N28

Length:

11.4935 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4935 mm

Trade Compliance

S3507AI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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