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TCM38C17IDL

Texas Instruments

TCM38C17IDL by Texas Instruments

TCM38C17IDL by Texas Instruments is a 48-terminal PCM CODEC with 5V supply voltage, operating from -40 to 85°C. It features A/MU-LAW companding law, synchronous mode, and gull wing terminal form. Ideal for audio applications requiring small outline packages and industrial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,485 parts In-Stock

1+ parts

-

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3,485

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Digiode

USA . 1,343 parts In-Stock

1+ parts

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1,343

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LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 46 parts In-Stock

1+ parts

$10.644

100+ parts

-

1k+ parts

$11.134

10k+ parts

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46

$10.644

-

$11.134

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DigiPath Technology Company

USA . 247 parts In-Stock

1+ parts

$11.720

100+ parts

$10.782

1k+ parts

-

10k+ parts

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247

$11.720

$10.782

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ChromeModa Solutions

Germany . 5,503 parts In-Stock

1+ parts

$11.959

100+ parts

$9.806

1k+ parts

-

10k+ parts

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5,503

$11.959

$9.806

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$11.959

100+ parts

$11.361

1k+ parts

$10.763

10k+ parts

-

312

$11.959

$11.361

$10.763

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AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$14.276

100+ parts

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531

$14.276

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One Stop Electronics

USA . 1,264 parts In-Stock

1+ parts

$114.000

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1,264

$114.000

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Corphita

USA . 4,458 parts In-Stock

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4,458

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Microchip USA

USA . 185 parts In-Stock

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185

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Overview

Elevate your audio experience with the TCM38C17IDL by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality audio codecs that are perfect for a wide range of applications. Whether you're designing a new telecommunications system or upgrading your current equipment, this product offers unmatched value and performance. With its compact design and advanced features, the TCM38C17IDL is sure to impress even the most discerning customers. Upgrade your audio solutions today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during use or transportation.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and coordination between different components, resulting in reliable performance and high-quality audio output.

Power Supplies (V): 5

The 5V power supply is common and easily accessible, providing a stable voltage to ensure consistent operation of the audio codec.

No. of Terminals: 48

With 48 terminals, the audio codec offers a wide range of connectivity options and functionality for advanced audio processing and signal routing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable operation in demanding environments without the risk of overheating or performance degradation.

Technology: CMOS

The CMOS technology used in the audio codec ensures low power consumption, high integration, and compatibility with a wide range of digital systems for versatile applications.

Technical Specifications

Audio Codecs TCM38C17IDL attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL-DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.18 dB

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.794 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TCM38C17IDL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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