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TCM320AC36IPT

Texas Instruments

TCM320AC36IPT by Texas Instruments

TCM320AC36IPT by Texas Instruments is a 48-terminal audio codec with A-LAW companding law, operating at temperatures from -40 to 85°C. It features synchronous/asynchronous modes, 13-bit linear coding, and a nominal voltage of 3V. Ideal for telecom applications requiring PCM encoding/decoding in a compact flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,931 parts In-Stock

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6,931

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Digiode

USA . 402 parts In-Stock

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402

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Resion

USA . 68 parts In-Stock

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68

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Global Solutions Electronics Company

USA . 60 parts In-Stock

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60

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Mil-Aero Solutions, Inc.

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$2.756

100+ parts

-

1k+ parts

$3.242

10k+ parts

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2,168

$2.756

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$3.242

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DigiPath Technology Company

USA . 1,509 parts In-Stock

1+ parts

$3.035

100+ parts

$2.792

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1,509

$3.035

$2.792

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

1+ parts

$3.097

100+ parts

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$2.787

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1,273

$3.097

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$2.787

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ChromeModa Solutions

Germany . 43 parts In-Stock

1+ parts

$3.097

100+ parts

$2.540

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43

$3.097

$2.540

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AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$14.699

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373

$14.699

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One Stop Electronics

USA . 1,604 parts In-Stock

1+ parts

$710.000

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1,604

$710.000

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Corphita

USA . 3,638 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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A-Z Elektronik GmbH

Germany . 600 parts In-Stock

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600

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Kepictronics

USA . 400 parts In-Stock

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400

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Overview

Experience superior audio quality with the TCM320AC36IPT by Texas Instruments, a leading manufacturer known for reliable and innovative products. This Audio Codec is ideal for a wide range of applications, offering a seamless blend of synchronous and asynchronous operation modes. With a compact design and high-quality materials, this product delivers exceptional performance and durability. Enhance your audio systems with the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and able to withstand various environmental conditions, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy mounting on printed circuit boards, saving space and making the assembly process more efficient.

Package Shape: SQUARE

The square shape helps with easy orientation and fitting in compact spaces within electronic devices.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation, allowing the product to be used in different configurations based on the requirements.

No. of Terminals: 48

Having a higher number of terminals enables more functionalities and connections, enhancing the product's capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with low profile and fine pitch, suitable for applications where space-saving is crucial.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in hot environments, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold conditions without any issues, expanding its usability.

Terminal Position: QUAD

The quad terminal position provides secure and stable connections, reducing the risk of signal interference or disconnection.

Linear Coding: 13-BIT

The 13-bit linear coding offers high precision and accuracy in data conversion, ensuring clear and consistent audio output.

Maximum Seated Height: 1.6 mm

The low seated height makes the product suitable for slim devices where space is limited, improving overall design flexibility.

Width: 7 mm

The compact width allows for easy integration into electronic systems without taking up too much space.

Companding Law: A-LAW

The A-law companding law ensures efficient signal compression and expansion, leading to improved audio quality and dynamic range.

Length: 7 mm

The short length of the product contributes to its compact design, making it ideal for applications with size restrictions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, increasing efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring secure connections.

Maximum Supply Current: 7.5 mA

The low maximum supply current helps in conserving power and reducing energy consumption, making the product more energy-efficient.

Telecom IC Type: PCM CODEC

Being a PCM codec type specifically designed for telecom applications, the product ensures high-quality voice communication and data transmission.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides compatibility with a wide range of systems and power sources, enhancing versatility.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and precise connections, making the product suitable for advanced electronic designs.

Maximum Gain Tolerance: 1 dB

The tight gain tolerance of 1 dB ensures accurate signal amplification and consistent audio output, enhancing the product's performance.

Filter: YES

The inclusion of a filter helps in noise reduction and signal filtering, ensuring clear and distortion-free audio output.

Technical Specifications

Audio Codecs TCM320AC36IPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TCM320AC36IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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