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TCM320AC37IPT

Texas Instruments

TCM320AC37IPT by Texas Instruments

Texas Instruments TCM320AC37IPT is a 48-terminal audio codec with A-LAW companding law. Operating in synchronous/asynchronous mode, it has a 13-bit linear coding and supports PCM codec for telecom applications. With a low profile flatpack package style, it operates b/w -40 to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,332 parts In-Stock

1+ parts

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2,332

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Digiode

USA . 1,111 parts In-Stock

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1,111

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 943 parts In-Stock

1+ parts

$1.153

100+ parts

-

1k+ parts

$1.967

10k+ parts

-

943

$1.153

-

$1.967

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

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1,034

$1.270

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ChromeModa Solutions

Germany . 4,001 parts In-Stock

1+ parts

$1.296

100+ parts

$1.063

1k+ parts

-

10k+ parts

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4,001

$1.296

$1.063

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

1+ parts

$1.296

100+ parts

-

1k+ parts

$1.166

10k+ parts

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1,735

$1.296

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$1.166

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AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$17.233

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406

$17.233

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One Stop Electronics

USA . 1,236 parts In-Stock

1+ parts

$142.000

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1,236

$142.000

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Corphita

USA . 4,573 parts In-Stock

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4,573

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Overview

Unleash the power of crystal-clear audio with the TCM320AC37IPT by Texas Instruments, a leading manufacturer known for top-quality products. This Audio Codec is perfect for a wide range of applications, offering unmatched value and benefits to customers. With its sleek design and advanced features, this product ensures a seamless audio experience like never before. Experience the difference with Texas Instruments and elevate your audio game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the audio codec, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making the product more versatile for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operating modes provides flexibility in connectivity options and compatibility with different systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec energy-efficient and reliable in various environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the audio codec can function reliably in a wide range of operating conditions without overheating.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 volts ensures compatibility with standard power sources and allows for easy integration into existing electronic systems.

Filter: YES

The inclusion of a filter helps improve the audio quality by reducing noise and interference, resulting in clearer sound output from the audio codec.

Technical Specifications

Audio Codecs TCM320AC37IPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TCM320AC37IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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