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ETC5054FN

STMicroelectronics

ETC5054FN by STMicroelectronics

STMicroelectronics ETC5054FN is a PCM CODEC with +-5V supplies, 20 terminals, and MU-LAW companding law. It operates in synchronous/asynchronous mode for audio applications. Package style is chip carrier with tin/lead finish, suitable for telecom ICs at -5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,377 parts In-Stock

1+ parts

-

100+ parts

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4,377

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-

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Digiode

USA . 2,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,288

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-

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Anansix

USA . 1,915 parts In-Stock

1+ parts

-

100+ parts

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-

1,915

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-

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PC Components Company LLC

USA . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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49

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Bristol Electronics

USA . 49 parts In-Stock

1+ parts

-

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49

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2 parts In-Stock

1+ parts

-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 485 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

485

$0.248

-

-

$0.238

Northwest PG Solutions

USA . 422 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

$0.241

422

$0.273

-

-

$0.241

IDEA Electronic Components Group

UK . 1,042 parts In-Stock

1+ parts

$6.236

100+ parts

-

1k+ parts

$5.612

10k+ parts

-

1,042

$6.236

-

$5.612

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MKK Technologies

India . 1,340 parts In-Stock

1+ parts

$11.726

100+ parts

-

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10k+ parts

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1,340

$11.726

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$11.726

100+ parts

-

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1,340

$11.726

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Corphita

USA . 3,649 parts In-Stock

1+ parts

-

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3,649

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Parana Technologies

USA . 163 parts In-Stock

1+ parts

-

100+ parts

$7.456

1k+ parts

-

10k+ parts

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163

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$7.456

-

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Overview

Upgrade your audio experience with the ETC5054FN by STMicroelectronics. This high-quality audio codec offers seamless integration, reliable performance, and versatile applications in the telecom industry. With advanced technology and a commercial temperature grade, this PCM CODEC ensures optimal sound quality and efficient power consumption. Trust STMicroelectronics to deliver exceptional value and benefits to enhance your audio solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable audio devices.

Surface Mount: YES

The surface mount design allows for easy and efficient assembly in manufacturing, saving time and cost.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different audio processing applications.

Power Supplies (V): +-5

The dual power supply of +-5V allows for compatibility with a wide range of audio systems and circuits.

No. of Terminals: 20

Having 20 terminals provides ample connections for various audio input and output channels, enabling versatile audio processing capabilities.

Companding Law: MU-LAW

The use of mu-law companding law ensures optimal dynamic range compression and expansion for high-quality audio signal processing.

Technology: CMOS

The CMOS technology ensures low power consumption and high integration, making the product efficient and cost-effective.

Telecom IC Type: PCM CODEC

Being a PCM codec, the product is suitable for telecommunication applications where precise digital audio conversion is required.

Filter: YES

The inclusion of a filter aids in noise reduction and signal conditioning, resulting in cleaner and more accurate audio output.

Technical Specifications

Audio Codecs ETC5054FN attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

ETC5054FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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