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ETC5054FN-X

STMicroelectronics

ETC5054FN-X by STMicroelectronics

ETC5054FN-X by STMicroelectronics is an Audio Codec with +-5V power supplies, 20 terminals, and operates in synchronous/asynchronous mode. It is a PCM CODEC telecom IC suitable for industrial temperature grade applications. The chip carrier package style with quad terminal position and J bend form makes it ideal for audio processing in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,893

-

-

-

-

Vyrian

USA . 3,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,698

-

-

-

-

Anansix

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 817 parts In-Stock

1+ parts

$0.262

100+ parts

-

1k+ parts

-

10k+ parts

$0.252

817

$0.262

-

-

$0.252

Northwest PG Solutions

USA . 2,165 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

10k+ parts

$0.254

2,165

$0.288

-

-

$0.254

IDEA Electronic Components Group

UK . 1,936 parts In-Stock

1+ parts

$16.209

100+ parts

-

1k+ parts

$14.589

10k+ parts

-

1,936

$16.209

-

$14.589

-

MKK Technologies

India . 1,683 parts In-Stock

1+ parts

$30.481

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$30.481

-

-

-

DigiPath Technology Company

USA . 1,683 parts In-Stock

1+ parts

$30.481

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$30.481

-

-

-

Parana Technologies

USA . 231 parts In-Stock

1+ parts

-

100+ parts

$19.381

1k+ parts

-

10k+ parts

-

231

-

$19.381

-

-

Corphita

USA . 88 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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88

-

-

-

-

Overview

Enhance your audio experience with the ETC5054FN-X by STMicroelectronics, the ultimate choice in Audio Codecs. Manufactured by the industry leader, this high-quality product offers unparalleled performance and reliability. Whether you're designing a communication system or a multimedia device, this versatile codec delivers exceptional value and benefits. Experience crystal-clear sound and seamless operation with the ETC5054FN-X, setting new standards in audio technology. Unlock the full potential of your audio applications with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, which is ideal for portable audio devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the product on PCBs, saving space and reducing manufacturing time.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility for different system requirements and integration options.

Power Supplies (V): +-5

Having power supplies of +-5V ensures stable operation and compatibility with standard voltage levels used in audio circuits.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows the product to perform reliably in harsh environmental conditions, making it suitable for a wide range of applications.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and compatibility with digital systems, enhancing the overall performance of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in audio circuits, providing compatibility and ease of integration with other components.

Companding Law: MU-LAW

The use of MU-LAW companding law allows for efficient compression and expansion of audio signals, leading to higher quality audio output.

Technical Specifications

Audio Codecs ETC5054FN-X attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.9662 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

ETC5054FN-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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