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TLV320AIC15CDBTR

Texas Instruments

TLV320AIC15CDBTR by Texas Instruments

TLV320AIC15CDBTR by Texas Instruments is a 2-channel Audio Codec with 16um resolution. It operates at 1.8-3.3V, has a max output voltage of 2.35V, and supports two's complement input/output codes. Ideal for telecom applications requiring programmable codecs in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,707 parts In-Stock

1+ parts

-

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1k+ parts

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7,707

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Digiode

USA . 794 parts In-Stock

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794

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,296 parts In-Stock

1+ parts

$8.427

100+ parts

-

1k+ parts

$9.067

10k+ parts

-

2,296

$8.427

-

$9.067

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DigiPath Technology Company

USA . 418 parts In-Stock

1+ parts

$9.280

100+ parts

-

1k+ parts

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418

$9.280

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ChromeModa Solutions

Germany . 4,977 parts In-Stock

1+ parts

$9.469

100+ parts

$7.765

1k+ parts

-

10k+ parts

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4,977

$9.469

$7.765

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IDEA Electronic Components Group

UK . 414 parts In-Stock

1+ parts

$9.469

100+ parts

$8.996

1k+ parts

$8.522

10k+ parts

-

414

$9.469

$8.996

$8.522

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$15.471

100+ parts

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472

$15.471

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One Stop Electronics

USA . 569 parts In-Stock

1+ parts

$540.000

100+ parts

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569

$540.000

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Corphita

USA . 2,018 parts In-Stock

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2,018

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Microchip USA

USA . 345 parts In-Stock

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345

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Overview

Enhance your audio experience with the TLV320AIC15CDBTR from Texas Instruments, a leading manufacturer in the industry. This high-quality audio codec is perfect for a wide range of applications, offering customers unmatched value and versatility. With its advanced features and reliable performance, this product ensures exceptional sound quality and seamless operation. Upgrade your audio system today with the TLV320AIC15CDBTR and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability allows for easier and more efficient PCB assembly, saving time and effort during production.

Output Code: TWOS COMPLEMENT

The use of twos complement output code ensures accurate and high-resolution signal processing, leading to superior audio quality.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination between different components of the codec, minimizing signal distortion and improving overall performance.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for versatile compatibility with various systems and requirements.

No. of Terminals: 30

With a high number of terminals, the codec offers extensive connectivity options and versatility in system integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh or demanding environmental conditions.

No. of Channels: 2

Dual channels provide stereo sound output, enhancing the audio experience for users.

Technical Specifications

Audio Codecs TLV320AIC15CDBTR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V DIGTAL SUPPLY, TLV320AIC15IDBTG4 THIS PART IS DELELTED FOR LEAF CLASS FIX

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

Length:

7.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TLV320AIC15CDBTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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