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TCM29C23DWR

Texas Instruments

TCM29C23DWR by Texas Instruments

TCM29C23DWR by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and A/MU-LAW companding law. It operates in synchronous/asynchronous mode and is ideal for PCM CODEC applications in telecom ICs. The small outline package measures 12.8mm x 7.5mm x 2.65mm, making it suitable for commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,909 parts In-Stock

1+ parts

-

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1k+ parts

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6,909

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Digiode

USA . 3,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,353

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 465 parts In-Stock

1+ parts

$9.723

100+ parts

-

1k+ parts

-

10k+ parts

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465

$9.723

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Parana Technologies

USA . 123 parts In-Stock

1+ parts

$11.186

100+ parts

$1,038.828

1k+ parts

$10.068

10k+ parts

-

123

$11.186

$1,038.828

$10.068

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DigiPath Technology Company

USA . 42 parts In-Stock

1+ parts

$12.318

100+ parts

$11.332

1k+ parts

-

10k+ parts

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42

$12.318

$11.332

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ChromeModa Solutions

Germany . 3,016 parts In-Stock

1+ parts

$12.569

100+ parts

$10.307

1k+ parts

-

10k+ parts

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3,016

$12.569

$10.307

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IDEA Electronic Components Group

UK . 694 parts In-Stock

1+ parts

$12.569

100+ parts

$11.941

1k+ parts

$11.312

10k+ parts

-

694

$12.569

$11.941

$11.312

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One Stop Electronics

USA . 972 parts In-Stock

1+ parts

$899.000

100+ parts

-

1k+ parts

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10k+ parts

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972

$899.000

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A-Z Elektronik GmbH

Germany . 12,595 parts In-Stock

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12,595

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Metaverse IC Inc.

Canada . 5,038 parts In-Stock

1+ parts

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5,038

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 975 parts In-Stock

1+ parts

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975

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Overview

Enhance your audio experience with the TCM29C23DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs that are perfect for a wide range of applications. From telecommunications to consumer electronics, this product offers unmatched value, benefits, and advantages. With its compact package style and advanced technology, customers can expect superior performance and reliability. Upgrade your audio systems today with the TCM29C23DWR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes allows for versatile usage in different scenarios.

Power Supplies (V): +-5

With a wide power supply range, this product can be used in various setups without compatibility issues.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliable performance even in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Nominal Supply Voltage: 5 V

A standard 5V supply voltage simplifies integration with other components and systems.

Filter: YES

The built-in filter helps in reducing noise and improving the audio quality, making this product suitable for critical audio applications.

Technical Specifications

Audio Codecs TCM29C23DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.5 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM29C23DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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