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TP3054N/NOPB

Texas Instruments

TP3054N/NOPB by Texas Instruments

TP3054N/NOPB by Texas Instruments is an audio codec with 16 terminals, operating at +-5V. It features companding law MU-LAW and operates in synchronous mode. Ideal for telecom applications, this PCM CODEC has a temperature range of -40 to 85°C and uses CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,468 parts In-Stock

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Digiode

USA . 2,664 parts In-Stock

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Anansix

USA . 274 parts In-Stock

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Sea View Technologies

USA . 11 parts In-Stock

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Bristol Electronics

USA . 11 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 910 parts In-Stock

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$7.544

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$8.056

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910

$7.544

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$8.056

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DigiPath Technology Company

USA . 1,101 parts In-Stock

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$8.306

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$8.306

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ChromeModa Solutions

Germany . 5,495 parts In-Stock

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$8.476

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$6.950

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$8.476

$6.950

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IDEA Electronic Components Group

UK . 872 parts In-Stock

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$8.476

100+ parts

$8.052

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$7.628

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872

$8.476

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AZTECH Wire

Italy . 796 parts In-Stock

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$12.308

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Ampacity Inc.

Singapore . 916 parts In-Stock

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$396.000

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$396.000

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One Stop Electronics

USA . 769 parts In-Stock

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$581.000

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Perfect Parts

USA . 416 parts In-Stock

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Corphita

USA . 357 parts In-Stock

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Microchip USA

USA . 131 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Experience the next level of audio quality with the TP3054N/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability. This PCM CODEC is perfect for telecom applications, providing crystal-clear sound and seamless operation. With its compact design and industrial-grade temperature range, this codec offers unmatched value and benefits to customers. Upgrade your audio systems today with the TP3054N/NOPB and elevate your listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into system designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate data transfer and timing synchronization.

Power Supplies (V): +-5

The dual power supplies provide stability and flexibility in powering the device.

No. of Terminals: 16

With a high number of terminals, the product can support multiple connections and functionalities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability for secure connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

Audio Codecs TP3054N/NOPB attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

21.755 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

.009 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3054N/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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