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TCM129C23DWR

Texas Instruments

TCM129C23DWR by Texas Instruments

TCM129C23DWR by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and A/MU-LAW companding law. It operates in synchronous/asynchronous mode and is ideal for PCM CODEC applications in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,354

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-

-

-

Digiode

USA . 2,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,785

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$9.955

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$9.955

-

-

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Parana Technologies

USA . 2,267 parts In-Stock

1+ parts

$13.477

100+ parts

-

1k+ parts

$13.989

10k+ parts

-

2,267

$13.477

-

$13.989

-

DigiPath Technology Company

USA . 1,960 parts In-Stock

1+ parts

$14.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

$14.840

-

-

-

ChromeModa Solutions

Germany . 3,741 parts In-Stock

1+ parts

$15.143

100+ parts

$12.417

1k+ parts

-

10k+ parts

-

3,741

$15.143

$12.417

-

-

IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$15.143

100+ parts

$14.386

1k+ parts

$13.629

10k+ parts

-

2,010

$15.143

$14.386

$13.629

-

One Stop Electronics

USA . 1,266 parts In-Stock

1+ parts

$581.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,266

$581.000

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-

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A-Z Elektronik GmbH

Germany . 6,593 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,593

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Corphita

USA . 2,505 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,505

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Overview

Experience top-of-the-line audio quality with the TCM129C23DWR by Texas Instruments, a leading manufacturer known for its innovative solutions. As part of the Audio Codecs category, this product offers seamless integration and versatile applications in various industries. With a compact design and wide temperature range, it provides reliable performance in challenging environments. Enhance your audio systems with the exceptional value, benefits, and advantages that this PCM CODEC delivers to customers, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, and also resistant to heat and moisture.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility and compatibility for various applications.

Power Supplies (V): +-5

The dual power supplies of +-5V provide stable and reliable power for the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand extreme conditions without compromising performance.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, contributing to efficient operation.

Filter: YES

The inclusion of a filter helps in reducing noise and improving signal quality, resulting in clear and precise audio output.

Technical Specifications

Audio Codecs TCM129C23DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.5 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C23DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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