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TCM129C13ADY

Texas Instruments

TCM129C13ADY by Texas Instruments

TCM129C13ADY by Texas Instruments is an Audio Codec with 20 terminals, operating from -40 to 85°C. It features A/MU-LAW companding law, synchronous/asynchronous mode, and a small outline package style. Ideal for PCM CODEC applications in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,567 parts In-Stock

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4,567

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Vyrian

USA . 4,169 parts In-Stock

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4,169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$6.291

100+ parts

-

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864

$6.291

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Parana Technologies

USA . 774 parts In-Stock

1+ parts

$10.633

100+ parts

-

1k+ parts

$11.124

10k+ parts

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774

$10.633

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$11.124

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DigiPath Technology Company

USA . 270 parts In-Stock

1+ parts

$11.708

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270

$11.708

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IDEA Electronic Components Group

UK . 1,162 parts In-Stock

1+ parts

$11.947

100+ parts

$11.350

1k+ parts

$10.752

10k+ parts

-

1,162

$11.947

$11.350

$10.752

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ChromeModa Solutions

Germany . 551 parts In-Stock

1+ parts

$11.947

100+ parts

$9.797

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551

$11.947

$9.797

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One Stop Electronics

USA . 1,641 parts In-Stock

1+ parts

$940.000

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1,641

$940.000

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Corphita

USA . 4,096 parts In-Stock

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4,096

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Overview

Experience crystal-clear audio quality with the TCM129C13ADY by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. As part of the Audio Codecs category, this product offers seamless integration and high-performance in various applications. Delight in the value and benefits this codec provides, such as reliable synchronous/asynchronous operation, compact package style, and industrial-grade temperature tolerance. Elevate your audio projects with the TCM129C13ADY and enjoy unmatched quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating modes allows for compatibility with various systems and setups.

No. of Terminals: 20

Having a high number of terminals enables versatile connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand varying environmental conditions.

Companding Law: A/MU-LAW

The companding law ensures effective encoding and decoding of audio signals for high-quality output.

Nominal Supply Voltage: 5 V

Stable supply voltage ensures consistent performance of the product.

Filter: YES

Inclusion of a filter helps in refining the audio output for improved sound quality.

Technical Specifications

Audio Codecs TCM129C13ADY attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-J20

Length:

12.825 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.51 mm

Trade Compliance

TCM129C13ADY Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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