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TCM129C13DY-00

Texas Instruments

TCM129C13DY-00 by Texas Instruments

Texas Instruments TCM129C13DY-00 is a 20-terminal PCM CODEC with companding law A/MU-LAW. Operating in synchronous mode, it has a temperature range of -40 to 85°C and requires -5V nominal negative supply voltage. This small outline audio codec is ideal for telecom applications due to its filter feature and industrial-grade temperature rating.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,878 parts In-Stock

1+ parts

-

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3,878

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Digiode

USA . 218 parts In-Stock

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-

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218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 598 parts In-Stock

1+ parts

$8.235

100+ parts

-

1k+ parts

$8.849

10k+ parts

-

598

$8.235

-

$8.849

-

DigiPath Technology Company

USA . 442 parts In-Stock

1+ parts

$9.068

100+ parts

$8.343

1k+ parts

-

10k+ parts

-

442

$9.068

$8.343

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ChromeModa Solutions

Germany . 4,336 parts In-Stock

1+ parts

$9.253

100+ parts

$7.587

1k+ parts

-

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4,336

$9.253

$7.587

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$9.253

100+ parts

$8.790

1k+ parts

$8.328

10k+ parts

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1,711

$9.253

$8.790

$8.328

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AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$19.757

100+ parts

-

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346

$19.757

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One Stop Electronics

USA . 1,529 parts In-Stock

1+ parts

$150.000

100+ parts

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1,529

$150.000

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Corphita

USA . 171 parts In-Stock

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171

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Overview

Enhance your audio systems with the TCM129C13DY-00 from Texas Instruments, a leading manufacturer known for top-quality products. As an essential component in the Audio Codecs category, this product offers unparalleled value and benefits to customers looking to improve their sound equipment. With its compact design, wide operating temperature range, and advanced features like companding law and filter capabilities, the TCM129C13DY-00 is perfect for various applications in the telecommunications industry. Upgrade your audio devices today with this high-performance PCM CODEC and experience superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature makes installation and replacement of the codec easy and efficient.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate timing and data synchronization, resulting in high performance audio processing.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable power for optimal performance of the codec.

Filter: YES

Having a built-in filter helps to enhance audio quality by reducing noise and interference during signal processing.

Technical Specifications

Audio Codecs TCM129C13DY-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-J20

Length:

12.825 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.51 mm

Trade Compliance

TCM129C13DY-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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