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TCM320AC40IN

Texas Instruments

TCM320AC40IN by Texas Instruments

TCM320AC40IN by Texas Instruments is a 20-terminal PCM CODEC with A-LAW companding law, operating from -40 to 85 °C. It features 13-bit linear coding, synchronous/asynchronous mode, and a max supply current of 7.5 mA. Ideal for telecom applications requiring audio codecs in an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,095 parts In-Stock

1+ parts

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4,095

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Digiode

USA . 2,913 parts In-Stock

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2,913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,335 parts In-Stock

1+ parts

$2.557

100+ parts

-

1k+ parts

$3.045

10k+ parts

-

2,335

$2.557

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$3.045

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DigiPath Technology Company

USA . 1,912 parts In-Stock

1+ parts

$2.816

100+ parts

-

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1,912

$2.816

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ChromeModa Solutions

Germany . 2,108 parts In-Stock

1+ parts

$2.873

100+ parts

$2.356

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-

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2,108

$2.873

$2.356

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IDEA Electronic Components Group

UK . 1,912 parts In-Stock

1+ parts

$2.873

100+ parts

-

1k+ parts

$2.586

10k+ parts

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1,912

$2.873

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$2.586

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AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$11.176

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792

$11.176

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One Stop Electronics

USA . 1,388 parts In-Stock

1+ parts

$966.000

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1,388

$966.000

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Corphita

USA . 3,836 parts In-Stock

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3,836

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Overview

Experience high-quality audio processing with the TCM320AC40IN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this audio codec that offers exceptional value and benefits for various applications. With its compact size and innovative technology, this product provides customers with reliable performance and versatility. Upgrade your audio systems with the TCM320AC40IN and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the audio codec, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes allows for flexibility in different audio signal processing applications, making this codec suitable for a variety of uses.

No. of Terminals: 20

With 20 terminals, this audio codec offers a wide range of connectivity options for integrating it into various audio systems and circuits.

Technology: CMOS

The CMOS technology used in this audio codec ensures low power consumption and high performance, making it an energy-efficient choice for audio processing tasks.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this audio codec is compatible with a wide range of power sources and can be easily integrated into different electronic devices.

Technical Specifications

Audio Codecs TCM320AC40IN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM320AC40IN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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