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TP13067BDWR

Texas Instruments

TP13067BDWR by Texas Instruments

TP13067BDWR by Texas Instruments is an Audio Codec with 20 terminals, operating from -40 to 85°C. It features A-LAW companding law, synchronous/asynchronous mode, and a small outline package. Ideal for telecom applications requiring PCM CODEC technology in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,245 parts In-Stock

1+ parts

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8,245

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Digiode

USA . 3,351 parts In-Stock

1+ parts

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3,351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 354 parts In-Stock

1+ parts

$7.058

100+ parts

-

1k+ parts

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354

$7.058

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Parana Technologies

USA . 1,470 parts In-Stock

1+ parts

$9.179

100+ parts

-

1k+ parts

$9.824

10k+ parts

-

1,470

$9.179

-

$9.824

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DigiPath Technology Company

USA . 2,249 parts In-Stock

1+ parts

$10.107

100+ parts

-

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10k+ parts

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2,249

$10.107

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ChromeModa Solutions

Germany . 3,971 parts In-Stock

1+ parts

$10.313

100+ parts

$8.457

1k+ parts

-

10k+ parts

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3,971

$10.313

$8.457

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$10.313

100+ parts

$9.797

1k+ parts

$9.282

10k+ parts

-

2,134

$10.313

$9.797

$9.282

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One Stop Electronics

USA . 533 parts In-Stock

1+ parts

$410.000

100+ parts

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533

$410.000

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Corphita

USA . 2,853 parts In-Stock

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2,853

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Overview

Experience high-quality audio performance with the TP13067BDWR by Texas Instruments, a leading manufacturer in the industry. This Audio Codec offers unparalleled value and benefits for a wide range of applications, delivering crisp and clear sound in a compact package. Whether you're designing telecommunications equipment or audio processing systems, this product's synchronous/asynchronous operation and A-Law companding law ensure optimal performance. Trust Texas Instruments to provide reliable and innovative solutions for all your audio codec needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the audio codec, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving time and space in the device design.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operating modes gives flexibility in different audio communication setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this audio codec can function reliably even in demanding industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high integration capabilities, making the audio codec energy-efficient and cost-effective.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 volts ensures compatibility with common power sources, simplifying the design and operation of the audio codec.

Technical Specifications

Audio Codecs TP13067BDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TP13067BDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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