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TLV320AIC3106IZQE

Texas Instruments

TLV320AIC3106IZQE by Texas Instruments

TLV320AIC3106IZQE by Texas Instruments is an Audio Codec with 2 channels. It operates in synchronous mode, supports two's complement input/output codes, and has a nominal voltage of 1.8V. Ideal for PCM codec applications in industrial settings due to its compact grid array package and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,540 parts In-Stock

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4,540

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Vyrian

USA . 2,945 parts In-Stock

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2,945

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 724 parts In-Stock

1+ parts

$8.091

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724

$8.091

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Parana Technologies

USA . 1,683 parts In-Stock

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$10.143

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-

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$10.684

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1,683

$10.143

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$10.684

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IDEA Electronic Components Group

UK . 2,233 parts In-Stock

1+ parts

$11.397

100+ parts

$10.827

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$10.257

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2,233

$11.397

$10.827

$10.257

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ChromeModa Solutions

Germany . 1,456 parts In-Stock

1+ parts

$11.397

100+ parts

$9.346

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1,456

$11.397

$9.346

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One Stop Electronics

USA . 385 parts In-Stock

1+ parts

$589.000

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385

$589.000

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Corphita

USA . 3,538 parts In-Stock

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3,538

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Microchip USA

USA . 348 parts In-Stock

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348

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DigiPath Technology Company

USA . 137 parts In-Stock

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$10.276

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137

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$10.276

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Overview

Elevate your audio experience with the TLV320AIC3106IZQE from Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-quality products that set the industry standard. The TLV320AIC3106IZQE is perfect for applications such as telecommunications, where crystal-clear sound is essential. With its innovative design and advanced features, this audio codec offers unmatched value and performance. Upgrade your audio system today with the TLV320AIC3106IZQE and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and resistance to corrosion, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on the circuit board.

Output Code: TWOS COMPLEMENT

Two's complement output code ensures accurate representation of signed numbers, enhancing the audio quality.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, delivering high performance in audio processing.

No. of Terminals: 80

A high number of terminals provide connectivity options and flexibility in the audio codec's interface.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold environments.

No. of Channels: 2

Dual channels offer stereo audio output, enhancing the audio experience for the user.

Nominal Supply Voltage: 1.8 V

Stable supply voltage ensures consistent performance and power efficiency in the audio codec.

Technical Specifications

Audio Codecs TLV320AIC3106IZQE attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC3106IZQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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