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TCM129C23DW

Texas Instruments

TCM129C23DW by Texas Instruments

TCM129C23DW by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and A/MU-LAW companding law. It operates in synchronous/asynchronous mode and is ideal for PCM CODEC applications in industrial temperature environments. The compact rectangular package measures 12.8mm x 7.5mm x 2.65mm, making it suitable for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,061 parts In-Stock

1+ parts

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4,061

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Vyrian

USA . 3,571 parts In-Stock

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3,571

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Q Components

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

$12.367

100+ parts

-

1k+ parts

$12.807

10k+ parts

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1,302

$12.367

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$12.807

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ChromeModa Solutions

Germany . 4,614 parts In-Stock

1+ parts

$13.896

100+ parts

$11.395

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-

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4,614

$13.896

$11.395

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IDEA Electronic Components Group

UK . 361 parts In-Stock

1+ parts

$13.896

100+ parts

$13.201

1k+ parts

$12.506

10k+ parts

-

361

$13.896

$13.201

$12.506

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AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$15.264

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234

$15.264

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One Stop Electronics

USA . 796 parts In-Stock

1+ parts

$742.000

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796

$742.000

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Perfect Parts

USA . 2,305 parts In-Stock

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DigiPath Technology Company

USA . 2,083 parts In-Stock

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$12.529

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2,083

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$12.529

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Corphita

USA . 1,722 parts In-Stock

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Kepictronics

USA . 64 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TCM129C23DW Audio Codec. This versatile component is perfect for a wide range of applications, from telecommunications to audio recording and playback. With its compact design and advanced features, this codec offers exceptional value and performance to customers looking for top-notch audio solutions. Trust Texas Instruments for cutting-edge technology and seamless integration in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different applications.

Power Supplies (V): +-5

The wide power supply range of +-5V ensures compatibility with various systems.

No. of Terminals: 20

With 20 terminals, this product offers versatile connectivity options.

Temperature Grade: INDUSTRIAL

Being industrial grade ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic devices, making it easy to integrate.

Filter: YES

The inclusion of a filter helps in enhancing the audio quality and reducing noise in the output signal.

Technical Specifications

Audio Codecs TCM129C23DW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.5 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C23DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-655-4868, 5962016554868

NIIN

016554868

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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