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TCM129C13N-10

Texas Instruments

TCM129C13N-10 by Texas Instruments

TCM129C13N-10 by Texas Instruments is an Audio Codec with 20 terminals, operating from -40 to 85°C. It features A/MU-LAW companding law, synchronous mode, and a max supply current of 13mA. Ideal for telecom applications requiring PCM encoding/decoding in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,068 parts In-Stock

1+ parts

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3,068

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Digiode

USA . 2,868 parts In-Stock

1+ parts

-

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-

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2,868

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 333 parts In-Stock

1+ parts

$6.166

100+ parts

-

1k+ parts

$6.936

10k+ parts

-

333

$6.166

-

$6.936

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DigiPath Technology Company

USA . 1,068 parts In-Stock

1+ parts

$6.789

100+ parts

-

1k+ parts

-

10k+ parts

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1,068

$6.789

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ChromeModa Solutions

Germany . 6,527 parts In-Stock

1+ parts

$6.928

100+ parts

$5.681

1k+ parts

-

10k+ parts

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6,527

$6.928

$5.681

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IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$6.928

100+ parts

-

1k+ parts

$6.235

10k+ parts

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2,246

$6.928

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$6.235

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$17.796

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638

$17.796

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One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$685.000

100+ parts

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1,104

$685.000

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Corphita

USA . 4,099 parts In-Stock

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4,099

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Overview

Enhance your audio experience with the TCM129C13N-10 by Texas Instruments, a top-of-the-line Audio Codec designed to deliver exceptional sound quality and performance. Manufactured by the trusted Texas Instruments, this product guarantees reliability and durability. Perfect for a wide range of applications, this Audio Codec is a must-have for audio professionals and enthusiasts alike. Upgrade your audio systems today and enjoy the value and benefits that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and communication between components, leading to reliable audio processing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in challenging environmental conditions.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and efficient operation of the audio codec.

Filter: YES

The presence of a filter helps in noise reduction and ensures high-quality audio output.

Technical Specifications

Audio Codecs TCM129C13N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM129C13N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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