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MC145483SD

NXP Semiconductors

MC145483SD by NXP Semiconductors

PCM CODEC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

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Chip Stock

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Bristol Electronics

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Vyrian

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J2 Sourcing AB

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Cyclops Electronics Ltd

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MRC Electronics

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Digiode

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LIBRA Elektronik GmbH

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Zilex Electronics Inc.

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Carlin Systems, Inc.

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Semi Source

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Microchip USA

USA . 155 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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GreenTree Electronics

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Pacific Micro-Tech

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Technical Specifications

Audio Codecs MC145483SD attributes and parameters. Explore more Audio Codecs devices from NXP Semiconductors

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

-21 dB

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Linear Coding:

13-BIT

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Resolution (um):

13

Maximum Seated Height:

1.99 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.29 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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