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TCM29C14AMFK

Texas Instruments

TCM29C14AMFK by Texas Instruments

TCM29C14AMFK by Texas Instruments is a PCM CODEC with A/MU-LAW companding law. It operates synchronously in military-grade temperature range (-55 to 125 °C) and has 28 terminals in a square chip carrier package. Ideal for telecom applications requiring audio codecs with filter, it supports -5V to +5V nominal voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,493 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,493

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-

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Digiode

USA . 1,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,054 parts In-Stock

1+ parts

$6.472

100+ parts

-

1k+ parts

$7.216

10k+ parts

-

1,054

$6.472

-

$7.216

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ChromeModa Solutions

Germany . 71 parts In-Stock

1+ parts

$7.272

100+ parts

$5.963

1k+ parts

-

10k+ parts

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71

$7.272

$5.963

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IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$7.272

100+ parts

-

1k+ parts

$6.545

10k+ parts

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31

$7.272

-

$6.545

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AZTECH Wire

Italy . 492 parts In-Stock

1+ parts

$8.271

100+ parts

-

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492

$8.271

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-

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One Stop Electronics

USA . 978 parts In-Stock

1+ parts

$354.000

100+ parts

-

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978

$354.000

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Corphita

USA . 4,467 parts In-Stock

1+ parts

-

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4,467

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DigiPath Technology Company

USA . 727 parts In-Stock

1+ parts

-

100+ parts

$6.556

1k+ parts

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727

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$6.556

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Overview

Enhance your audio systems with the TCM29C14AMFK by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a leading player in the Audio Codecs category, this product offers seamless integration and high performance for a wide range of applications. With its innovative design and cutting-edge technology, customers can expect exceptional value, benefits, and advantages that elevate their audio experience to new heights. Trust Texas Instruments to deliver excellence in every aspect of your audio needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures excellent thermal and mechanical stability, making this product reliable in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and reducing assembly time.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can perform reliably in harsh environments without risking damage due to overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this codec efficient and reliable for audio processing.

Technical Specifications

Audio Codecs TCM29C14AMFK attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

TCM29C14AMFK Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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