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TLV320AIC12KIDBTG4

Texas Instruments

TLV320AIC12KIDBTG4 by Texas Instruments

TLV320AIC12KIDBTG4 by Texas Instruments is a 30-terminal audio codec with 4 channels, operating at -40 to 85°C. It features two's complement output/input codes, synchronous operation, and supports voltage outputs up to 2.35V. Ideal for industrial telecom applications due to its small outline package and low supply current of 2mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,176 parts In-Stock

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Digiode

USA . 4,556 parts In-Stock

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Nova Conductors

Japan . 69 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 353 parts In-Stock

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$8.805

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353

$8.805

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Parana Technologies

USA . 884 parts In-Stock

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$9.815

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$10.385

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884

$9.815

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DigiPath Technology Company

USA . 71 parts In-Stock

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$10.807

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$9.943

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IDEA Electronic Components Group

UK . 1,137 parts In-Stock

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$11.028

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$10.477

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$9.925

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$11.028

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$9.925

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ChromeModa Solutions

Germany . 260 parts In-Stock

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$11.028

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$9.043

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260

$11.028

$9.043

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$14.631

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$13.314

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$11.997

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$14.631

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$11.997

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One Stop Electronics

USA . 356 parts In-Stock

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$221.000

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Ampacity Inc.

Singapore . 195 parts In-Stock

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$299.000

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Corphita

USA . 4,097 parts In-Stock

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Microchip USA

USA . 1,975 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Perfect Parts

USA . 69 parts In-Stock

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69

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Overview

Enhance your audio experience with the TLV320AIC12KIDBTG4 by Texas Instruments. This high-quality Audio Codec offers unmatched precision and reliability, thanks to its industry-leading manufacturer. Ideal for a wide range of applications, this programmable codec provides exceptional value with its advanced features and cutting-edge technology. Elevate your audio projects with the TLV320AIC12KIDBTG4 and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protects the internal components of the audio codec, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing costs.

Output Code: TWOS COMPLEMENT

Two's complement encoding provides accurate representation of audio signals and ensures high quality output.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards, optimizing space utilization in electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise synchronization with other components, improving overall performance of the audio codec.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows flexibility in integrating the audio codec into different systems with varying power requirements.

No. of Terminals: 30

With a high number of terminals, this audio codec can support complex signal processing and connectivity options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the audio codec to function in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the audio codec.

Maximum Output Voltage: 2.35 V

The high maximum output voltage ensures strong and clear audio signals, suitable for various audio applications.

No. of Channels: 4

With four channels, this audio codec supports multi-channel audio processing, ideal for stereo or surround sound applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Technical Specifications

Audio Codecs TLV320AIC12KIDBTG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Maximum Supply Current:

2 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC12KIDBTG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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