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TLV32014KIDBTRG4

Texas Instruments

TLV32014KIDBTRG4 by Texas Instruments

TLV32014KIDBTRG4 by Texas Instruments is a 2-channel audio codec with 16um resolution, operating at -40 to 85 °C. It features two's complement output/input codes, synchronous mode, and supports voltage outputs up to 2.35V. Ideal for industrial applications requiring programmable codecs in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,867 parts In-Stock

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Digiode

USA . 623 parts In-Stock

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623

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 501 parts In-Stock

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$6.602

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501

$6.602

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Parana Technologies

USA . 1,231 parts In-Stock

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$12.954

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$13.446

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1,231

$12.954

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$13.446

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ChromeModa Solutions

Germany . 5,756 parts In-Stock

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$14.555

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$11.935

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$14.555

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

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$14.555

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$13.827

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$13.100

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1,832

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$13.100

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Corohmni

South Africa . 294 parts In-Stock

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$15.258

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294

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Ampacity Inc.

Singapore . 1,048 parts In-Stock

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$110.000

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$110.000

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One Stop Electronics

USA . 558 parts In-Stock

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$525.000

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558

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Semicontronic

India . 858 parts In-Stock

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$690.000

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$672.750

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$669.300

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858

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$669.300

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Argo Parts USA

USA . 4,378 parts In-Stock

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Continental Prestige Electronics

USA . 2,956 parts In-Stock

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DigiPath Technology Company

USA . 2,351 parts In-Stock

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$13.123

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$13.123

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Corphita

USA . 675 parts In-Stock

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675

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Overview

Enhance your audio experience with the TLV32014KIDBTRG4 by Texas Instruments, a top-quality Audio Codec designed for seamless integration into a variety of applications. With Texas Instruments' reputation for excellence in manufacturing, this codec delivers exceptional performance and reliability. Whether you're looking to upgrade your audio equipment or enhance your communication systems, this versatile codec offers value, benefits, and advantages that cater to your specific needs. Elevate your sound quality and functionality with the TLV32014KIDBTRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the internal components of the audio codec, making it ideal for long-term use.

Output Code: TWOS COMPLEMENT

The use of twos complement output code ensures accurate representation of analog signals, resulting in high-fidelity audio output.

Power Supplies (V): 1.8, 3.3

Having multiple power supply options allows for flexibility in different operating environments, making the audio codec versatile and adaptable.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions, making this audio codec suitable for industrial use.

Resolution (um): 16

With a resolution of 16 um, this audio codec can accurately capture and reproduce audio signals with precision, resulting in high-quality sound output.

Technical Specifications

Audio Codecs TLV32014KIDBTRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV32014KIDBTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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