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TLV320AC36CPT

Texas Instruments

TLV320AC36CPT by Texas Instruments

TLV320AC36CPT by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding and mu-law companding law. It operates on 3/5V power supplies, has a max supply current of 7.5mA, and is ideal for PCM codec applications in telecom due to its synchronous/asynchronous operating mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,758 parts In-Stock

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5,758

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Digiode

USA . 2,141 parts In-Stock

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2,141

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Electronics Depot

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$6.387

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715

$6.387

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Parana Technologies

USA . 544 parts In-Stock

1+ parts

$13.603

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$14.102

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544

$13.603

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$14.102

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DigiPath Technology Company

USA . 1,221 parts In-Stock

1+ parts

$14.978

100+ parts

$13.780

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1,221

$14.978

$13.780

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ChromeModa Solutions

Germany . 5,244 parts In-Stock

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$15.284

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$12.533

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5,244

$15.284

$12.533

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$15.284

100+ parts

$14.520

1k+ parts

$13.756

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2,030

$15.284

$14.520

$13.756

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One Stop Electronics

USA . 578 parts In-Stock

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$627.000

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578

$627.000

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A-Z Elektronik GmbH

Germany . 7,301 parts In-Stock

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7,301

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Corphita

USA . 2,812 parts In-Stock

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Kepictronics

USA . 353 parts In-Stock

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353

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Overview

Elevate your audio experience with the TLV320AC36CPT by Texas Instruments, a top-of-the-line Audio Codec designed to deliver unparalleled sound quality and reliability. Manufactured by industry leader Texas Instruments, this cutting-edge product is perfect for a wide range of applications in the audio industry. With its advanced features and innovative design, the TLV320AC36CPT offers customers exceptional value and unmatched performance. Upgrade your audio systems today and immerse yourself in the ultimate listening experience with this state-of-the-art Audio Codec.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material helps in reducing weight and cost of the product while providing sufficient protection to the internal components.

Power Supplies (V): 3/5

The availability of multiple power supply options gives flexibility in choosing the appropriate voltage for different applications, making the product versatile.

No. of Terminals: 48

A higher number of terminals allow for more connectivity options and features, enhancing the functionality of the product.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes allows for compatibility with a wide range of systems and makes the product adaptable to various environments.

Filter: YES

Having a built-in filter ensures clean and quality audio output, reducing noise and interference in the signal, making it a reliable choice for audio applications.

Technical Specifications

Audio Codecs TLV320AC36CPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC36CPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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