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TCM320AC41CN

Texas Instruments

TCM320AC41CN by Texas Instruments

TCM320AC41CN by Texas Instruments is a 20-terminal PCM CODEC with A-LAW companding law, 13-bit linear coding, and synchronous/asynchronous operation. It comes in an in-line package style with dimensions of 24.325mm x 7.62mm x 5.08mm, suitable for telecom applications requiring audio processing and filtering capabilities at temperatures ranging from 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,052 parts In-Stock

1+ parts

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2,052

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Digiode

USA . 1,596 parts In-Stock

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1,596

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

$2.105

100+ parts

-

1k+ parts

$2.621

10k+ parts

-

1,640

$2.105

-

$2.621

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DigiPath Technology Company

USA . 498 parts In-Stock

1+ parts

$2.318

100+ parts

$2.132

1k+ parts

-

10k+ parts

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498

$2.318

$2.132

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ChromeModa Solutions

Germany . 5,990 parts In-Stock

1+ parts

$2.365

100+ parts

$1.939

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-

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5,990

$2.365

$1.939

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

1+ parts

$2.365

100+ parts

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1k+ parts

$2.128

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2,183

$2.365

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$2.128

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$16.220

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638

$16.220

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One Stop Electronics

USA . 852 parts In-Stock

1+ parts

$461.000

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852

$461.000

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Corphita

USA . 2,687 parts In-Stock

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2,687

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Overview

Enhance your audio products with the TCM320AC41CN by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a leading player in the audio codecs category, this PCM CODEC delivers exceptional performance and precision with its A-LAW companding law and 13-bit linear coding. Ideal for synchronous and asynchronous applications, this versatile component offers seamless integration and optimal sound processing. Elevate your audio experience with the TCM320AC41CN and enjoy unparalleled value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internals of the codec, making it sturdy and reliable for long-term use.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation modes allows for flexibility in different system setups, making this codec compatible with a variety of applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components in a system, ensuring versatility and ease of integration.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this codec can withstand demanding environmental conditions without compromising performance, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the codec.

Technical Specifications

Audio Codecs TCM320AC41CN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM320AC41CN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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