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MC145484DW

NXP Semiconductors

MC145484DW by NXP Semiconductors

PCM CODEC; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e0; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 220; Terminal Finish: TIN LEAD;

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,654 parts In-Stock

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3,654

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Anansix

USA . 2,446 parts In-Stock

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2,446

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ComSIT Distribution GmbH

Germany . 318 parts In-Stock

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318

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Vyrian

USA . 279 parts In-Stock

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279

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Legend Electronics Inc.

USA . 214 parts In-Stock

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214

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Bristol Electronics

USA . 152 parts In-Stock

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152

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Atlantic Semiconductor

USA . 131 parts In-Stock

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131

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J2 Sourcing AB

Sweden . 74 parts In-Stock

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74

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LIBRA Elektronik GmbH

Germany . 38 parts In-Stock

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38

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Flex Direct, LLC

USA . 21 parts In-Stock

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Resion

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 448 parts In-Stock

1+ parts

$22.064

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448

$22.064

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One Stop Electronics

USA . 2,260 parts In-Stock

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$121.000

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2,260

$121.000

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Kepictronics

USA . 7,800 parts In-Stock

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7,800

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A-Z Elektronik GmbH

Germany . 5,807 parts In-Stock

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5,807

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Corphita

USA . 2,825 parts In-Stock

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UNI Independent Distributors

Spain . 2,469 parts In-Stock

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2,469

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Technical Specifications

Audio Codecs MC145484DW attributes and parameters. Explore more Audio Codecs devices from NXP Semiconductors

Specs

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

220

Telecom IC Type:

Terminal Finish:

TIN LEAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MC145484DW Telecommunications trade compliance attributes, and parameters.

NSN

5962-01-534-8085, 5962015348085

NIIN

015348085

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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