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MC145484DT

NXP Semiconductors

MC145484DT by NXP Semiconductors

PCM CODEC; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e0; Moisture Sensitivity Level (MSL): 1; Terminal Finish: TIN LEAD; Peak Reflow Temperature (C): 220;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,967 parts In-Stock

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Digiode

USA . 4,967 parts In-Stock

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4,967

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Anansix

USA . 1,827 parts In-Stock

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1,827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 307 parts In-Stock

1+ parts

$20.168

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307

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One Stop Electronics

USA . 2,117 parts In-Stock

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$346.000

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$346.000

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UNI Independent Distributors

Spain . 3,914 parts In-Stock

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Corphita

USA . 2,940 parts In-Stock

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2,940

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Technical Specifications

Audio Codecs MC145484DT attributes and parameters. Explore more Audio Codecs devices from NXP Semiconductors

Specs

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

220

Telecom IC Type:

Terminal Finish:

TIN LEAD

Maximum Time At Peak Reflow Temperature (s):

30

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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