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TLV320AC36IPT

Texas Instruments

TLV320AC36IPT by Texas Instruments

TLV320AC36IPT by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding, operating at 3/5V. It features companding law μ-law, synchronous/asynchronous mode, and operates in industrial temperature range. Ideal for PCM codec applications requiring low profile flatpack package with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,998 parts In-Stock

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7,998

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Digiode

USA . 328 parts In-Stock

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328

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NexGen Digital

USA . 8 parts In-Stock

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8

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Beltway Electronics Company

USA . 8 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 728 parts In-Stock

1+ parts

$8.292

100+ parts

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$8.914

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728

$8.292

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$8.914

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DigiPath Technology Company

USA . 1,011 parts In-Stock

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$9.131

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$8.400

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1,011

$9.131

$8.400

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ChromeModa Solutions

Germany . 5,708 parts In-Stock

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$9.317

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$7.640

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$9.317

$7.640

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

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$9.317

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$8.851

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$8.385

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1,872

$9.317

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$8.385

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AZTECH Wire

Italy . 701 parts In-Stock

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$16.669

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701

$16.669

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Ampacity Inc.

Singapore . 1,478 parts In-Stock

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$539.000

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$539.000

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One Stop Electronics

USA . 1,530 parts In-Stock

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$540.000

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$540.000

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Kepictronics

USA . 34,583 parts In-Stock

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Lixinc

USA . 13,416 parts In-Stock

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Corphita

USA . 4,067 parts In-Stock

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4,067

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Overview

Experience crystal-clear audio quality like never before with the TLV320AC36IPT by Texas Instruments, a leading manufacturer known for top-notch products in the audio codecs category. This versatile device offers seamless operation in both synchronous and asynchronous modes, making it perfect for a wide range of applications. With its compact design and low profile package style, this codec is not only easy to integrate into your projects but also ensures maximum performance. Upgrade your audio solutions today with the TLV320AC36IPT and enjoy unparalleled sound quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material ensures durability and stability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic devices.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies provides flexibility in diverse electronic applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Companding Law: MU-LAW

MU-law companding law preserves signal quality and dynamic range, resulting in high-quality audio output.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Audio Codecs TLV320AC36IPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC36IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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