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TCM29C13DW-00

Texas Instruments

TCM29C13DW-00 by Texas Instruments

TCM29C13DW-00 by Texas Instruments is a PCM CODEC with A/MU-LAW companding law. It operates synchronously at temperatures from 0 to 70°C, with -5V negative and 5V nominal voltages. This small outline package audio codec has 20 terminals for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,226 parts In-Stock

1+ parts

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7,226

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Digiode

USA . 1,069 parts In-Stock

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1,069

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Distributors (Availability)

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$7.008

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-

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281

$7.008

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Parana Technologies

USA . 869 parts In-Stock

1+ parts

$14.794

100+ parts

-

1k+ parts

$15.225

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869

$14.794

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$15.225

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ChromeModa Solutions

Germany . 4,286 parts In-Stock

1+ parts

$16.622

100+ parts

$13.630

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4,286

$16.622

$13.630

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IDEA Electronic Components Group

UK . 2,018 parts In-Stock

1+ parts

$16.622

100+ parts

$15.791

1k+ parts

$14.960

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-

2,018

$16.622

$15.791

$14.960

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Semicontronic

India . 949 parts In-Stock

1+ parts

$128.000

100+ parts

$124.800

1k+ parts

$124.160

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949

$128.000

$124.800

$124.160

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Ampacity Inc.

Singapore . 861 parts In-Stock

1+ parts

$594.000

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861

$594.000

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One Stop Electronics

USA . 140 parts In-Stock

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$691.000

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140

$691.000

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DigiPath Technology Company

USA . 1,443 parts In-Stock

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$14.986

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1,443

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$14.986

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Corphita

USA . 198 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Enhance your audio systems with the top-quality TCM29C13DW-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees reliability and performance. This Audio Codec is perfect for applications requiring synchronous operation and companding law features. With a small outline package and commercial temperature grade, this product offers exceptional value and benefits to customers seeking high-quality audio solutions. Upgrade your audio experience with the TCM29C13DW-00 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product durable and lightweight, which is ideal for portable audio devices.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data processing, resulting in high-quality audio output.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and allows for advanced functionality in audio processing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V allows for efficient power management and compatibility with a wide range of systems.

Telecom IC Type: PCM CODEC

Being a Pulse Code Modulation (PCM) CODEC, this product offers high-fidelity audio encoding and decoding, making it suitable for telecom and audio applications.

Technical Specifications

Audio Codecs TCM29C13DW-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM29C13DW-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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